Bicheng Electronics Technology Co., Ltd
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This double-sided (2-layer) rigid PCB is built with Rogers TMM10i, an isotropic thermoset microwave composite optimized for high-reliability RF and microwave applications.
1. PCB Specifications
| Parameter | Specification |
| Base Material | Rogers TMM10i (ceramic thermoset polymer composite) |
| Layer Configuration | Double-sided (2-layer, no blind vias—simplifies fabrication and reduces defects) |
| Board Dimensions | 70mm x 75mm per unit (tolerance: ±0.15mm for consistent assembly fit) |
| Minimum Trace/Space | 6/4 mils (enables dense routing for compact RF/microwave designs) |
| Minimum Hole Size | 0.3mm (supports miniaturized thru-hole components and precise via placement) |
| Finished Board Thickness | 0.8mm (thin-profile for space-constrained applications like antennas) |
| Finished Copper Weight | 1oz (1.4 mils, 35μm per outer layer—balances conductivity and design flexibility) |
| Via Plating Thickness | 20μm (enhances thru-hole reliability and current-carrying capacity) |
| Surface Finish | Immersion tin (delivers corrosion resistance, low contact resistance, and excellent solderability) |
| Silkscreen (Top/Bottom) | No / No (optimized for unobstructed signal paths in high-frequency circuits) |
| Solder Mask (Top/Bottom) | No / No (avoids dielectric interference in microwave applications) |
| Quality Assurance | 100% electrical testing prior to shipment (eliminates open circuits/shorts) |
2. PCB Stac-kup
| Layer/Component | Specification |
| Copper Layer 1 | 35μm (1oz) |
| Rogers TMM10i Core | 0.762mm (30mil) |
| Copper Layer 2 | 35μm (1oz) |
3. Quality Standards
Artwork Format: Gerber RS-274-X
Quality Certification: IPC-Class-2
Global Availability: Supplied worldwide to support international projects
4. Rogers TMM10i Material: Key Attributes
TMM10i is a ceramic thermoset composite that merges ceramic’s dielectric stability with PTFE’s processability, ideal for microwave and RF circuits:
Core Features
| Feature | Specification |
| Dielectric Constant (Dk) | 9.80 ± 0.245 (isotropic—consistent across all axes for predictable signal behavior) |
| Dissipation Factor (Df) | 0.0020 at 10GHz (ultra-low for minimal signal loss in high-frequency circuits) |
| Thermal Coefficient of Dk | -43 ppm/°K (stable dielectric properties across temperature fluctuations) |
| CTE (x/y/z) | 19ppm/K, 19ppm/K, 20ppm/K (matched to copper—reduces thermal stress and delamination) |
| Decomposition Temperature (Td) | 425°C (high thermal stability for harsh environments) |
| Thermal Conductivity | 0.76 W/mK (efficient heat transfer for power amplifiers and high-power circuits) |
| Thickness Range | 0.0015–0.500 inches (±0.0015”)—flexible for custom design needs |
5. Key Benefits
-Mechanical Durability: Resists creep and cold flow, ensuring long-term structural stability.
-Chemical Resistance: Withstands process chemicals, reducing damage during fabrication.
-Simplified Plating: No sodium napthanate treatment required prior to electroless plating—lowers production costs.
-Reliable Wire-Bonding: Thermoset resin base enables secure wire-bond connections for high-frequency components.
6. Typical Applications
This PCB is optimized for applications demanding stable dielectric performance and high reliability:
-RF and microwave circuitry (e.g., signal amplifiers, oscillators)
-Power amplifiers and combiners (high thermal conductivity supports heat management)
-Filters and couplers (isotropic Dk ensures precise signal filtering)
-Satellite communication systems (resists harsh environmental conditions)
-Global Positioning Systems (GPS) Antennas (stable Dk for accurate signal reception)
-Patch Antennas (thin profile and low Df enhance antenna efficiency)
-Dielectric polarizers and lenses (consistent Dk for lightwave control)
-Chip testers (reliable thru-holes support repeated component testing)
Conclusion
This double-sided TMM10i PCB delivers the precision, stability, and durability required for high-frequency RF and microwave applications. It is a trusted solution for engineers seeking to optimize performance in circuits like antennas, power amplifiers, and satellite communications systems.