Bicheng Electronics Technology Co., Ltd
We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified
Company Profile
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.
Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.
Main Business & PCB Applications
We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.
Main Material Partners
| Company Name: | Bicheng Electronics Technology Co., Ltd |
|---|---|
| Business Type: | Manufacturer,Distributor/Wholesaler,Exporter,Seller |
| Brands: | Bicheng |
| Employee Number: | 350~450 |
| Year Established: | 2003 |
| Total Sales Annual: | 10 million-18 million |
| Company Location: | 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103 |
| Factory Location: | 1716 Shiyuan Zhongxin, Xinyi Road, Fuyong, Baoan, Shenzhen, Guangdong, China 518103 |
We Are Your RF PCB Solution Provider!
Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB
ISO9001, ISO14001, IATF 16949 certified
PCB Pattern Plating
PCB Washing
Developing
Bicheng Electronics has two major production bases where are located in Shenzhen and Jiangmen. Shenzhen factory has over 300 employees and output PCB more than 10000 square meters per month. The Shenzhen factory is a brand new focusing on quick turn, prototype and small volume production.
The Jiangmen factory has two new industrial buildings that cover about 15,000 square meters, designed for mass production volumes. Brand new automated equipments are introduced from Israel, Japan, German, and Taiwan area. The output of Jiangmen factory for 2-10 layers is up to 30000 square meter per month. The foundation of Jiangmen facility increases our ability to supply high-end PCBs domestically and worldwide.
Our business is facing worldwide. Bicheng has strong and diverse PCB products, covering multi-layer boards up to 32 layers, flex-rigid combination, heavy copper, high frequency high speed, HDI and other types.
We’re committed to become a leading diversified PCB supplier, with precision products, Creating value for customers and create the future for staff.
Design For Manufacture
| Serial NO. | Procedure | Item | Manufacturing capability | ||
| Large volume （S<100 m²） | Middle volume （S<10 m²） | Prototype（S<1m²） | |||
| 1 | Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) | Min.isolation of layers | 0.1mm | 0.1mm | 0.06mm |
| 2 | Min.track and spacing | 5/5mil(18um) | 4/4mil(18um) | 3/3.5mil(18um) | |
| 3 | 5/5mil(35um) | 4/4mil(35um) | 3/4mil(35um) | ||
| 4 | 7/9mil(70um) | 6/8mil(70um) | 6/7mil(70um) | ||
| 5 | 9/11mil(105um) | 8/10mil(105um) | 8/9mil(105um) | ||
| 6 | 13/13mil(140um) | 12/12mil(140um) | 12/11mil(140um) | ||
| 7 | Min.distance from drill to conductor | 4 Layer 10mil，6 layer 10mil，8-12 layer 12mil | 4 layer 8mil，6 layer 8mil，8-12 layer 10mil，14-20 layer 14mil，22-32 layer 18mil | 4 layer 6mil，6 layer 6mil，8-14 layer 8mil，16-22 layer 12mil，24-32 layer 14mil | |
| 8 | Min.width of annular ring on inner layer | 4 Layer 10mil（35um），≥6 Layer 14mil（35um） | 4 Layer 8mil(35um)，≥6 layer 12mil（35um） | 4 Layer 6mil（35um），≥6 Layer 10mil（35um） | |
| 9 | Inner layer isolation ring width(Min) | 10mil （35um） | 8mil （35um） | 6mil （35um） | |
| 10 | Min.via pad diameter | 20mil （35um） | 16mil （35um） | 16mil （35um） | |
| 11 | Min. distance from board edge to conductor(no copper exposured)(inner layer) | 14 mil（35um） | 12 mil（35um）） | 8 mil（35um） | |
| 12 | Maximum copper weight(Inner layer and outer layer) | 3 OZ( 105 um ) | 4 OZ ( 140 um ) | 6 OZ( 210 um ) | |
| 13 | Core with different copper foil on both sides | / | 18/35,35/70 um | 18/35,35/70 um | |
| 14 | Laminating | Tolerance of laminate thickness | ±10% PCB thick | ±10% PCB thick | ±8% PCB thick |
| 15 | Maximum laminate thickness | 4.0mm | 6.0mm | 7.0mm | |
| 16 | Laminate alignment accuracy | ≤±5 mil | ≤±4 mil | ≤±4 mil | |
| 17 | Drill (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) | Min.drill bit diameter | 0.2 mm | 0.2 mm | 0.2 mm |
| 18 | Min.slot router diameter | 0.60 mm | 0.60 mm | 0.60 mm | |
| 19 | Min.tolerance of PTH slots | ±0.15mm | ±0.15mm | ±0.1mm | |
| 20 | Max.aspect ratio | 1:08 | 1:12 | 1:12 | |
| 21 | Hole tolerance | ±3mil | ±3mil | ±3mil | |
| 22 | Space of via to via | 6mil(same net)，12mil(different net) | 6mil(same net)，14mil(different net) | 4mil(same net)，12mil(different net) | |
| 23 | Space of component hole to component hole | 12mil(same net)，16mil(different net) | 12mil(same net)，16mil(different net) | 10mil(same net)，14mil(different net) | |
| 24 | Etching | Min.width of etching logo | 10mil(18um)，12 mil (35um)，12 mil(70um） | 8mil(18um)，10mil(35um)，12 mil(70um） | 6mil(18um)，8 mil(35um)，12mil(70um） |
| 25 | Etch factor | 1.6-2.2 | 1.6-2.2 | 1.6-2.2 | |
| 26 | Outer layer(18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) | Min.via pad diameter | 20mil | 16mil | 16mil |
| 27 | Min.BGA pad diameter | 12mil | 12mil | 10mil | |
| 28 | Min.track and spacing | 5/5mil(18um) | 4/4mil(18um) | 3/3.5mil(18um) | |
| 5/5mil(35um) | 4/4mil(35um) | 3/4mil(35um) | |||
| 7/9mil(70um) | 6/8mil(70um) | 6/7mil(70um) | |||
| 9/11mil(105um) | 8/10mil(105um) | 8/9mil(105um) | |||
| 13/13mil(140um) | 12/12mil(140um) | 12/11mil(140um) | |||
| 29 | Minimum grid | 10/10mil(35um) | 8/8mil(35um) | 4/8mil(35um) | |
| 30 | Min.space (conductor to pad, pad to pad) | 6mil(18um) | 5mil(18um) | 4mil(18um) | |
| 6mil(35um) | 5mil(35um) | 4mil(35um) | |||
| 9mil(70um) | 8mil(70um) | 7mil(70um) | |||
| 11mil(105um) | 10mil(105um) | 9mil(105um) | |||
| 13mil(140um) | 12mil(140um) | 11mil(140um) | |||
| 31 | Solder mask (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) | Maximum via-plug diameter | 0.5mm | 0.5mm | 0.5mm |
| 32 | Min.width of solder mask bridge | Green:5mil（35um） | Green:4mil（35um） | Green:4mil（35um） | |
| 33 | Yellow：5mil（35um） | Yellow：4mil（35um） | Yellow：4mil（35um） | ||
| 34 | Blue：5mil（35um） | Blue：4mil（35um） | Blue：4mil（35um） | ||
| 35 | Black：6mil（35um） | Black：6mil（35um） | Black：6mil（35um） | ||
| 36 | White:6mil（35um） | White:6mil（35um） | White:6mil（35um） | ||
| 37 | All of Matt：6mil | All of Matt：6mil | All of Matt：6mil | ||
| 38 | Green:5mil（70um） | Green:4mil（70um） | Green:4mil（70um） | ||
| 39 | Yellow：5mil（70um） | Yellow：4mil（70um） | Yellow：4mil（70um） | ||
| 40 | Blue：5mil（70um） | Blue：4mil（70um） | Blue：4mil（70um） | ||
| 41 | Black：6mil（70um） | Black：6mil（70um） | Black：6mil（70um） | ||
| 42 | White:6mil（70um） | White:6mil（70um） | White:6mil（70um） | ||
| 43 | Open solder mask | 4mil(35um) | 4mil(35um) | 3mil(35um) | |
| 44 | Solder mask coverage | 4mil(35um) | 4mil(35um) | 3mil(35um) | |
| 45 | Min.width of solder mask text | 9mil(35um) | 9mil(35um) | 8mil(35um) | |
| 46 | Min.thickness of Solder mask | 9um(35um) | 9um(35um) | 9um(35um) | |
| 47 | Max.thickness of solder mask | 30um(35um) | 30um(35um) | 30um(35um) | |
| 48 | Silkscreen | Min.width of silkscreen text | 6mil | 6mil | 5mil |
| 49 | Min.height of silkscreen text | 35mil | 35mil | 30mil | |
| 50 | Min.space from silkscreen to pads | 6mil | 6mil | 5mil | |
| 51 | Colour of silkscreen | White, Black, Yellow | |||
| 52 | Carbon ink | Carbon ink covers conductor or pads | 14mil | 13mil | 12mil |
| 53 | Mid distance from carbon ink to pads | 12mil | 11mil | 10mil | |
| 54 | Peelable mask | Peelable mask covers conductor or pads | 8mil | 7mil | 6mil |
| 55 | Min.distance from peelable mask to pads | 14mil | 13mil | 12mil | |
| 56 | Max.via-plug of Silk-screen method | 2.0mm | 2.0mm | 2.0mm | |
| 57 | Max. via-plug of aluminum foil method | 4.5mm | 4.5mm | 4.5mm | |
| 58 | Surface finish | Thickness of nickel of ENIG | 3-5um | 3-5um | 2-6.35um |
| 59 | Thickness of Gold of ENIG | 0.05-0.1um | |||
| 60 | Thickness of nickel of Gold finger | 3-5um | |||
| 61 | Thickness of Gold of Gold finger | 0.1-1.27um | |||
| 62 | Thickness of tin of HASL | 2.54-6.35um | |||
| 63 | Thickness of OSP | 0.2-0.5um | |||
| 64 | Thickness of tin of Immersion tin | 0.2-0.75um | |||
| 65 | Thickness of silver of Immersion silver | 0.15-0.75um | |||
| 66 | Contour process | Method of contour process | CNC milling, V-CUT, Break-out tap, break-out holes, Punching | ||
| 67 | Minimum router | 0.8mm | |||
| 68 | Min.tolerance of contour | ±0.15mm | ±0.13mm | ±0.1mm | |
| 69 | Min.distance of milling contour(no copper exposure) | 12mil | 10mil | 8mil | |
| 70 | Angle of V-CUT | 20、30、45、60 ±5 degree | |||
| 71 | Degree of symmetry of V-CUT | ±6mil | ±5mil | ±4mil | |
| 72 | Tolerance of residual thickness of V-CUT | ±6mil | ±5mil | ±4mil | |
| 73 | Tolerance of Chamfer angle of Gold finger | ±5 degree | ±5 degree | ±5 degree | |
| 74 | Tolerance of residual thickness of bevel edge of gold finger | ±5mil | ±5mil | ±5mil | |
| 75 | Min radius of inner corner | 0.4mm | |||
| 76 | Min. distance from edge to V-Cut (no copper exposure) | 18mil (1.6mm Thick, 20 degree V-groove cutter) | 14mil(1.6mm Thick, 20 degree V-groove cutter) | 12mil (1.6mm Thick, 20 degree V-groove cutter) | |
| 77 | 20mil (1.6mm Thick, 30 degree V-groove cutter) | 18mil (1.6mm Thick, 30 degree V-groove cutter) | 16mil (1.6mm Thick, 30 degree V-groove cutter) | ||
| 78 | 24mil (1.6mm Thick, 45 degree V-groove cutter) | 22mil (1.6mm Thick, 45 degree V-groove cutter) | 20mil (1.6mm Thick, 45 degree V-groove cutter) | ||
| 79 | 30mil (1.6mm Thick, 60 degree V-groove cutter) | 28mil (1.6mm Thick, 60 degree V-groove cutter) | 26mil (1.6mm Thick, 60 degree V-groove cutter) | ||
| 80 | Special tolerance | Board thickness of flying probe test | 0.6-4.0mm | ||
| 81 | Panel size of flying probe test | Size≤900X600mm, Small size can be compensated through manufacturing procedure | |||
| 82 | Panel size of fixture test method | Size≤460X380mm, Small size can be compensated through manufacturing procedure | |||
| 83 | Board thickness of fixture test method | 0.4-6.0mm | |||
| 84 | Tolerance of press-fit hole | ±2mil | |||
| 85 | Tolerance of NPTH | ±2mil | |||
| 86 | Tolerance of PCB thickness | 1.0mm≥PCB thickness, Tolerance ±0.1mm；1.0mm≤PCB thickness, Tolerance ±10% | |||
| 87 | Tolerance of depth of countersunk hole | ±0.2mm | |||
| 88 | Depth tolerance of blind slot | ±0.2mm | |||
| 89 | Maximum shipment size | Size≤1200X600mm（Double side, no test required） | |||
| 90 | Size≤1000X600mm（ Multilayer, no test required） | ||||
| 91 | Minimum shipment size | 10X10mm | |||
| 92 | PCB thickness of HASL | 0.8-3.0mm(Hole less 0.5mm should be use via-plug or mask-tent ) | |||
| 93 | HASL PCB Size | Size≤600X460mm | |||
| 94 | PCB thickness | 0.15-7.0mm | |||
| 95 | Depth of V groove | 0.8-3.2mm | |||
| 96 | Distance of non-continuous v-groove | ≥7mm | |||
| 97 | Max. drill diameter | Size≤6.5mm (Counterbore or router will be used for holes more than 6.5mm, Min.tolerance ±0.1mm ） | |||
| 98 | Max. countersink diameter | Size≤6.5mm Countersink can be used counterbore drill or router） | |||
| 99 | Distance of Bevel | Size≥11mm | Size≥5mm | Size≥5mm | |
| 100 | Thickness of peelable mask | 0.2-1.5mm ±0.15mm | |||
Every day, we dedicate to make things better, keep moving forward and never stop. We believe that teamwork is the guarantee of success, and our focus on creative process makes us even better.
Under the guidance of modern science management and instant information shared through the network technology, a high efficient working environment has been come into being. Skilled manufacturing experience can bring out the best performance of the equipment. You'll enjoy our professional super-value services with our high quality PCB's and flexible cooperation.
Your individual requirements can get satisfied at Bicheng and also our success can be achieved by the innovative products and competitive advantages.
BichengPCB is the brand of Shenzhen Bicheng Electronics Technology Co., Ltd. It can be traced back to 2003 when her name is Bicheng Enterprise Company. It specialized in blank printed circuit boards for single sided PCB and double sided PCB.
In order to meet the increases of market demands, we started to offer multilayer PCBs in 2008, layer count up to 32 layers. Bicheng introduced high frequency material in 2010 for the applications of antenna and amplifer and raido products.
With development, metal core PCB and hybrid PCB were suscessfully put into trial production and and got highly evaluated. In 2014 the company was restructured and reformed. Bicheng played a new role in the organiztion, focusing on global market sales and after-sales services.
Time flies to 2020, we have completed a series of integrated PCB products: High frequency/microwave PCB, Multi-layer/ Hybrid PCB, Metal Core PCB and Flexible Circuits.
As of now, our products can be found in more than 100 countries and regions in the world.
office building
PCB Test
Available Base Materials
Plating
| Market name: | North America,South America,Western Europe,Eastern Europe,Southeast Asia,Africa,Oceania,Worldwide |
|---|---|
| Contact Person: | Ivy Deng |