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Rogers 4003 32mil 0.813mm PCB RO4003C Double Sided RF High Frequency PCB for Filters
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RO4003C hydrocarbon ceramic laminates are designed to deliver exceptional high-frequency performance while keeping circuit construction costs low. As operating frequencies exceed 500 MHz, the laminates available for designers become limited, but RO4003C remains a reliable choice for RF microwave circuits, matching networks, and controlled impedance transmission lines. Its low dielectric loss makes it a preferred material for applications where standard circuit board materials cannot be used at higher operating frequencies. Additionally, RO4003C has a consistent dielectric constant across a wide frequency range and one of the lowest temperature coefficients of any circuit board material. Its thermal coefficient of expansion (CTE) offers several advantages to PCB designers, including high dimensional stability, which is critical for creating mixed dielectric multi-layer boards. Even under extreme thermal shock conditions, RO4003C's low Z-axis CTE ensures dependable plated through-hole quality. Furthermore, the material's expansion characteristics remain stable across the entire temperature range of PCB processing, thanks to its Tg of >280C.
PCB Specifications
| PCB SIZE | 98 x 72mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Double sided PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 35um(1oz)+PLATE |
| RO4003C 32 mil 0.813mm | |
| copper ------- 35um(1oz)+PLATE | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 6.98mil/6.28mil |
| Minimum / Maximum Holes: | 0.3/1.2mm |
| Number of Different Holes: | 5 |
| Number of Drill Holes: | 481 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 1 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | RO4003C 32 mil (0.813mm), Tg 288℃ |
| Final foil external: | 1.5oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 0.9 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold |
| Solder Mask Apply To: | NO |
| Solder Mask Color: | NO |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | NO |
| Colour of Component Legend | NO |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated Through Hole(PTH) |
| FLAMIBILITY RATING | N/A |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
RO4003C PCBs (Printed Circuit Boards) play a critical role in various electronic applications, including automotive radar and sensors, cellular base station antennas, direct broadcast satellites, low noise block, power amplifiers, and RFID.
Data Sheet of Rogers 4003C (RO4003C)
| RO4003C Typical Value | |||||
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.55 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0027 0.0021 | Z | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 x 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850) 19,450(2,821) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2) 100(14.5) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276 (40) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m (mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11 14 46 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.71 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
| Density | 1.79 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 1.05 (6.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||