6 Layer Hybrid PCB 10 mil with Blind Via

Hello everyone,

Warm greetings!

Today we’re talking about 6-layer hybrid PCB built on RO4350B and FR-4. Let’s see first one.

It’s for the application of radar antenna. Two cores of RO4350B on top side and bottom side, plated through holes connect each layer. Viewing from the stack-up, each dielectric material is more than 0.2mmm thick which result in whole PCB thickness to 1.9mm thick. Pads and holes are immersion gold plated. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are packed for shipment.

Let’s see second one.

This type is more complex than the first one. The 10mil RO4350B core is the same. The main difference is that it contains 3 types blind via. The specifications are as follows:

Base material: RO4350B 10mil + FR4

Layer count: 6 layers

Type: Blind via L1-L2, L1-L3, L1-L4

Format: 82mm x 95mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm/ Inner layer 35 μm

Solder mask / Legend: No

Final PCB height: 1.4 mm

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 20 working days

Shelf life: 6 months

There’s a very similar products whose inner-layers are using half ounce copper. Finished PCB thickness is 1.0mm. Following is the stack-up and microsecton.

There’re many advantages of RO4350B hybrid PCBs.

1) Signal integrity performance improved over the stack-ups with all FR4 board;

2) Cost reduced over stack-ups with all low loss material;

3) Engineering design prevents problems from occurring in pre-production;

4) ISO9000, ISO14001, IATF16949, UL Certified factory

5) IPC Class 2 / IPC Class 3;

The applications are wide, listed below:

-Radar data acquisition converter,

-miscrostrip antenna,

-tower-mounted booster,

-modular oscilloscope,

-attenuator and 5G antenna etc.

Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.

Appendix: PCB Data Sheet