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Hybrid PCB 1.4mm RO4003C and FR4 Through Holes PCB Impedance Controlled PCB

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Bicheng Electronics Technology Co., Ltd
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City:shenzhen
Province/State:guangdong
Country/Region:china
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Hybrid PCB 1.4mm RO4003C and FR4 Through Holes PCB Impedance Controlled PCB

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Brand Name :Bicheng
Model Number :BIC-083.V1.0
Certification :UL, ISO9001, IATF16949
Place of Origin :CHINA
MOQ :1PCS
Price :USD9.99-99.99
Payment Terms :T/T
Supply Ability :5000PCS per month
Delivery Time :8-9 working days
Packaging Details :Vacuum bags+Cartons
Base material :RO4003C+FR-4; RO4350B + FR4; F4B + FR4; Duroid/RT5880 + RO4350B; Duroid/RT5880 + FR4
Layer count :4 Layer, 6 Layer, Multilayer
PCB thickness :1.0-5.0mm
PCB size :≤400mm X 500mm
Solder mask :Green, Red, Blue, Black, Yellow
Silkscreen :White
Copper weight :0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface finish :Bare copper, HASL, ENIG, Immersion tin, OSP
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6 Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4 for Satellite Antenna

Today we’re introducing a type of 6-layer RF PCB built on 12mil RO4003C and FR-4. This board is used for satellite antenna. Following drawing is the stack-up of the board.

Hybrid PCB 1.4mm RO4003C and FR4  Through Holes PCB Impedance Controlled PCB

Viewing from the stack-up, the 12mil core is on the top layer and it mainly plays the roles of signal layer. The core has fixed thickness which is very important to the electrical length of RF lines on the circuit board. The rest layers are FR-4 epoxy glass material with similar thickness with RO4003C.

The detailed specifications are as follows.

Base material: 12mil 0.305mm RO4003C+ Tg170 FR-4

Dielectric constant: 3.38+/-0.05

Layer count: 6 layers

Via type: Through holes

Format: 105mm x 80mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35μm / Inner layer 18μm

Solder mask / Legend: Green / White

Final PCB height: 1.4 mm

Others: Impedance controlled PCB

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 10 working days

Shelf life: 6 months

At present, the mature mixed pressing materials are as follows:

RO4350B + FR4;

RO4003C + FR4;

F4B + FR4;

RT/duroid 5880 + RO4350B

RT/duroid 5880 + FR4

PCB Capability
PCB Type: Hybrid PCB, Mixed PCB
Mixed type: RO4350B + FR4;
  RO4003C + FR4;
  F4B + FR4;
  Duroid/RT5880 + RO4350B
  Duroid/RT5880 + FR4
Solder mask: Green, Red, Blue, Black, Yellow
Layer count: 4 Layer, 6 Layer, Multilayer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 1.0-5.0mm
PCB size: ≤400mm X 500mm
Surface finish: Bare copper, HASL, ENIG, Immersion tin, OSP
   

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