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2 Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With FR4 Stiffener for Embedded Systems Programming
(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)
General description
This is a type of 2 Layer flexible printed circuit (FPC) built on polyimide for the application of Embedded Systems Programming.
Basic specifications
Base material: Polyimide 25μm + 0.2mm stiffener of FR-4
Layer count: 2 layers
Type: Individual FPC
Format: 106mm x 69.5mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 μm/ Inner layer 0 μm
Solder mask / Legend: Yellow coverlay / No.
Final PCB height: 0.20 mm
Standard: IPC 6012 Class 2
Packing: 100 pieces are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months
Features and benefits
The end can be whole soldered;
Low cost;
Continuity of processing;
Excellent surface planarity to reduce failure rate during assembly and soldering;
Right manufacturing instruction (MI);
Strict WIP inspection and monitoring as well as working instruction;
Competitive price;
On-time service;
More than 18 years of PCB experience;
Applications
Toy lamp strip, Tablet PC capacitive screen soft board, medical keypad soft board, Automobile sensor flex board, mobile phone built-in antenna FPC, consumer ETC (Electronic Toll Collection) soft board
General Properties of Single Sided FCCL
| Test Item | Treatment Condition | Unit | Property Date | |||
| IPC Standard * value | Typical Value | |||||
| SF201 0512SE | SF201 0518SR | |||||
| Peel Strength (90º) | A | N/mm | ≥0.525 | 1.0 | 0.9 | |
| 288℃, 5s | ≥0.525 | 1.0 | 0.9 | |||
| Folding Endurance (MIT) | R0.8 X 4.9N | Times | - | ＞10000 | ＞10000 | |
| Thermal Stress | 288℃, 20s | - | - | No delamination | No delamination | |
| Dimensional Stability | MD | E-0.5/150 | % | ±0.2 | ±0.1 | ±0.1 |
| TD | ±0.1 | ±0.1 | ||||
| Chemical Resistance | After Chemical Exposure | % | ≥80 | ＞90 | ＞90 | |
| Dielectric Constant (1MHz) | C-24/23/50 | - | ≤4.0 | 3.2 | 3.2 | |
| Dissipation Factor (1MHz) | C-24/23/50 | - | ≤0.01 | 0.008 | 0.008 | |
| Volume Resistvitiy | C-96/35/90 | MΩ-cm | ≥10^6 | 4.5 x 10^8 | 4.5 x 10^8 | |
| Surface Resistance | C-96/35/90 | MΩ | ≥10^5 | 3.0 x 10^6 | 3.0 x 10^6 | |
Brief Introduction of FPC
Flexible Printed Circuit Board (FPC) is referred to as "soft board". In the industry, FPC is a printed circuit board made of flexible insulating substrate (mainly polyimide or polyester film), which has many advantages that rigid printed circuit boards do not have. For example, it can be freely bent, wound, folded. The volume of electronic products can be greatly reduced by using FPC, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communication, laptop, computer peripherals, PDA, digital camera and other fields or products.
FPC also has the advantages of good heat dissipation, solderability, easy mounting and low cost.
Flexible printed circuit board has one layer, two layers and multilayer board. The base material is polyimide clad laminate. This kind of material has high heat resistance and good dimensional stability. It is the final product through pressing with the coating film which has both mechanical protection and good electrical insulation. The surface and inner conductors of double-sided and multi-layer printed circuit boards are metallized to realize the electrical connection of inner and outer layers.
The function of flexible circuit board can be divided into four kinds, namely, lead line, printed circuit, connector and multifunction integrated system, which cover computer, computer peripheral auxiliary system, consumer household electrical appliance and automobile, etc.