Bicheng Electronics Technology Co., Ltd
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Thick PCB 2.4mm Circuit Board Dual Layer PCB Board Built on FR-4 With 2oz Copper
(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)
1.1 General description
This is a type of 2 oz double sided PCB built on FR-4 substrate with Tg 150°C for the application of micro SATA carrier board. It's 2.4 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and immersion gold(4 microinch gold) on pads. The base material is from ITEQ supplying single PCB. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panels are packed for shipment.
1.2 Features and benefits
1. Mid Tg substrate with Very Low moisture absorption and better CAF resistance;
2. Immersion gold has high solderability, no stressing of circuit boards and less contamination of PCB surface.
3. ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
4. 16000㎡ workshop and 30000㎡ output capability per month;
5. Experienced sales persons provide skilled customer services;
6. IPC Class 2 / IPC Class 3;
7. Prototype PCB capability and Volume Production capability;
8. More than 18+ years of PCB experience.
1.3 Applications
Security Alarm
Modem 4G WiFi
PLC Programming Tutorial
Modular Oscilloscope
Fiber optic receptors
1.4 PCB Parameter
| PCB SIZE | 65.5 x 33.75mm=1PCS |
| BOARD TYPE | Double Sided PCB |
| Number of Layers | 2 Layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 52.5um(1.5oz)+plate TOP layer |
| FR-4 2.3mm | |
| copper ------- 52.5um(1.5oz)+plate BOT layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 23 mil / 7.7 mil |
| Minimum / Maximum Holes: | 0.7 mm / 3.2 mm |
| Number of Different Holes: | 6 |
| Number of Drill Holes: | 23 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4 Tg150℃, er<5.4.IT-158, ITEQ Supplied |
| Final foil external: | 2 oz |
| Final foil internal: | 2 oz |
| Final height of PCB: | 2.4 mm ±0.2 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold (12.1% ) 0.1µm over 3µm nickel |
| Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
| Solder Mask Color: | Green, PSR-2000GT600D, Taiyo Supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP and Bottom. |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo brand |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through hole(PTH), minimum size 0.7mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
1.5 Our PCB Capability (2022)
| Parameter | Value |
| Layer Counts | 1-32 |
| Substrate Material | RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc. |
| Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance | ±0.0059" (0.15mm) |
| PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) | ±8% |
| Thickness Tolerance(t＜0.8mm) | ±10% |
| Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track | 0.003" (0.075mm) |
| Minimum Space | 0.003" (0.075mm) |
| Outer Copper Thickness | 35µm--420µm (1oz-12oz) |
| Inner Copper Thickness | 17µm--350µm (0.5oz - 10oz) |
| Drill Hole(Mechanical) | 0.0059" - 0.25" (0.15mm--6.35mm) |
| Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
| Registration (Mechanical) | 0.00197" (0.05mm) |
| Aspect Ratio | 12:1 |
| Solder Mask Type | LPI |
| Min Soldermask Bridge | 0.00315" (0.08mm) |
| Min Soldermask Clearance | 0.00197" (0.05mm) |
| Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance | ±10% |
| Surface Finish | HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger |