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Through hole Stencil For PCB Assembly Electro Polishing Solder Paste Stencil

Through hole Stencil For PCB Assembly Electro Polishing Solder Paste Stencil

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Brand Name :Bicheng
Model Number :BIC-957.V1.0
Certification :UL, ISO9001, IATF16949
Place of Origin :CHINA
MOQ :1PCS
Price :USD9.99-99.99
Payment Terms :T/T
Supply Ability :5000PCS per month
Delivery Time :8-9 working days
Packaging Details :Vacuum bags+Cartons
Base material :Stainless steel shim
Stencil size :370mm x 470mm, 420mm x 520mm, 550mm x 650mm
Foil Thickness :0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm
Appearance :Engraving and electro polishing
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View Product Description

SMT Stencil For PCB Assembly Solder Paste Laser Profile
1.1 General description
This is a type of solder paste SMT stencil (100% laser cut) built on 0.1mm stainless steel foil with aluminum frame 420 mm x 520 mm x 20mm dimension. It’s fabricated per IPC 7525A using supplied Gerber data, squeegee area locating in the center. Fiducal marks are through holes to suit for the SMT machine. It’s packed with KK carton (hard card) and usually 2 stencils are packed for shipment.
1.2 Features and benifits
The data file is used directly to produce and reduce the error rate;
The opening position accuracy of SMT template is very high: the whole process error is ≤ ±4 μ m;
The opening of SMT template has geometric figure, which is advantageous to the printing and forming of tin paste;
Engineering design prevents problems from occurring in pre production;
Money-saving, Worry-saving and Labor-saving;
Door to door shipment service;
More than 9000 types per month;
No minimum order quantity. 1 piece is available;
Through hole Stencil For PCB Assembly Electro Polishing Solder Paste StencilThrough hole Stencil For PCB Assembly Electro Polishing Solder Paste StencilThrough hole Stencil For PCB Assembly Electro Polishing Solder Paste StencilThrough hole Stencil For PCB Assembly Electro Polishing Solder Paste Stencil
1.3 Application
SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.
1.4 Parameter and data sheet
Dimension: 370mm x 470mm, 420mm x 520mm, 550mm x 650mm
Structure Stencil foils with aluminum frame
Base material Stainless steel shim
Foil Thickness 0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm
Aperture configured Laser cut
Appearance Engraving and electro polishing
Fiducial mark Through hole
Service area: Worldwide
Quantity of open pads: 1533
Advantages: a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother.
Application: CSP, BGA, 0.5mm QFP etc. package
1.5 Opening Holes Designs for SMT Stencil
Component Type Pitch Soldering Width Soldering Length Opening Width Opening Length Shim Thickness
PLCC 1.27mm 0.65mm 2.00mm 0.60mm 1.95mm 0.15-0.25mm
QFP 0.635mm 0.35mm 1.50mm 0.32mm 1.45mm 0.15-0.18mm
QFP 0.50mm 0.254-0.33mm 1.25mm 0.22-0.25mm 1.20mm 0.12-0.15mm
QFP 0.40mm 0.25mm 1.25mm 0.20mm 1.20mm 0.10-0.12mm
QFP 0.30mm 0.20mm 1.00mm 0.15mm 0.95mm 0.07-0.12mm
0402 0.50mm 0.65mm 0.45mm 0.60mm 0.12-0.15mm
0201 0.25mm 0.40mm 0.23mm 0.35mm 0.07-0.12mm
BGA 1.27mm 0.80mm 0.75mm 0.75mm 0.15-0.20mm
BGA 1.00mm 0.38mm 0.35mm 0.35mm 0.10-0.12mm
BGA 0.50mm 0.30mm 0.28mm 0.28mm 0.07-0.12mm
Flip Chip 0.25mm 0.12mm 0.12mm 0.12mm 0.12mm 0.08-0.10mm
Flip Chip 0.20mm 0.10mm 0.10mm 0.10mm 0.10mm 0.05-0.10mm

Through hole Stencil For PCB Assembly Electro Polishing Solder Paste StencilThrough hole Stencil For PCB Assembly Electro Polishing Solder Paste StencilThrough hole Stencil For PCB Assembly Electro Polishing Solder Paste Stencil

China Through hole Stencil For PCB Assembly Electro Polishing Solder Paste Stencil for sale

Through hole Stencil For PCB Assembly Electro Polishing Solder Paste Stencil

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