Home / Products / PCB Stencil /

High Precision PCB SMT Stencil Engraving Laser Cut Solder Stencil

Product Categories

Metal Core PCB

[26]

Contact Now

Bicheng Electronics Technology Co., Ltd

Visit Website

City:shenzhen

Province/State:guangdong

Country/Region:china

Contact Person:MsIvy Deng

View Contact Details

Contact Now

China High Precision PCB SMT Stencil Engraving Laser Cut Solder Stencil wholesale

High Precision PCB SMT Stencil Engraving Laser Cut Solder Stencil

Name: High Precision PCB SMT Stencil Engraving Laser Cut Solder Stencil
Brand: Bicheng
Price: 9.99 USD

Ask Latest Price

Video Channel

Brand Name :Bicheng

Model Number :BIC-960.V1.0

Certification :UL, ISO9001, IATF16949

Place of Origin :CHINA

MOQ :1PCS

Price :USD9.99-99.99

Payment Terms :T/T

Supply Ability :5000PCS per month

Delivery Time :8-9 working days

Packaging Details :Vacuum bags+Cartons

Base material :Stainless steel shim

Stencil size :520 x 420 mm =1 PCS

Foil Thickness :0.12mm

Appearance :Engraving and electro polishing

Contact Now

Add to Cart

View Product Description

Laser SMT Stencil Built on 520 X 420mm With Aluminum Fame

1.1 General description

This is a type of laser cut SMT stencil built on 0.12mm stainless steel foil with 420 mm x 520 mm x 20mm dimension. It’s fabricated per IPC 7525A using supplied Gerber data, squeegee area locating in the center. 4 sides of fiducal marks are through holes to suit for the SMT machine. It’s packed with KK carton (hard card) and usually 2 stencils are packed for shipment.

1.2 Features and benifits

The data file is used directly to produce and reduce the error rate;

The opening position accuracy of SMT template is very high: the whole process error is ≤ ±4 μ m;

The opening of SMT template has geometric figure, which is advantageous to the printing and forming of tin paste;

ISO9000 certified manufacturing factory;

12 hours quotation;

Quick Lead time: 1-2 days;

No MOQ, low cost for prototypes and small runs quantity;

High Precision PCB SMT Stencil Engraving Laser Cut Solder Stencil

1.3 Application

SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.

1.4 Parameter and data sheet

Dimension:	520 x 420 mm =1 PCS
Structure	Stencil foils with aluminum frame
Base material	Stainless steel shim
Foil Thickness	0.12mm
Aperture configured	Laser cut
Appearance	Engraving and electro polishing
Fiducial mark	Through hole
Service area:	Worldwide
Quantity of open pads:	1021
Advantages:	a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother.
Application:	CSP, BGA, 0.5mm QFP etc. package

1.5 Opening Holes Design For Stencil

Component Type	Pitch	Soldering Width	Soldering Length	Opening Width	Opening Length	Shim Thickness
PLCC	1.27mm	0.65mm	2.00mm	0.60mm	1.95mm	0.15-0.25mm
QFP	0.635mm	0.35mm	1.50mm	0.32mm	1.45mm	0.15-0.18mm
QFP	0.50mm	0.254-0.33mm	1.25mm	0.22-0.25mm	1.20mm	0.12-0.15mm
QFP	0.40mm	0.25mm	1.25mm	0.20mm	1.20mm	0.10-0.12mm
QFP	0.30mm	0.20mm	1.00mm	0.15mm	0.95mm	0.07-0.12mm
0402		0.50mm	0.65mm	0.45mm	0.60mm	0.12-0.15mm
0201		0.25mm	0.40mm	0.23mm	0.35mm	0.07-0.12mm
BGA	1.27mm	0.80mm		0.75mm	0.75mm	0.15-0.20mm
BGA	1.00mm	0.38mm		0.35mm	0.35mm	0.10-0.12mm
BGA	0.50mm	0.30mm		0.28mm	0.28mm	0.07-0.12mm
Flip Chip	0.25mm	0.12mm	0.12mm	0.12mm	0.12mm	0.08-0.10mm
Flip Chip	0.20mm	0.10mm	0.10mm	0.10mm	0.10mm	0.05-0.10mm