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Rogers RO3203 Double Sided 60mil High Frequency PCB For Base Station Infrastructure
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RO3203 High Frequency Circuit Materials of Rogers Corporation are ceramic-filled laminates reinforced with woven fiberglass. This material is engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The dielectric constant of RO3203 High Frequency Circuit Materials is 3.02. This, along with a dissipation factor of 0.0016, extends the useful frequency range beyond 40 GHz.
RO3203 laminates combine the surface smoothness of a non-woven PTFE laminate, for finer line etching tolerances, with the rigidity of a woven-glass PTFE laminate. These materials can be fabricated into printed circuit boards using
standard PTFE circuit board processing techniques. Available cladding options are 0.5, 1 or 2 oz./ft2 (17, 35, 70 micron thick) electrodeposited copper foil. These laminates are manufactured under an ISO 9002 certified quality system.
Features:
1. Woven glass reinforcement improves rigidity for easier handling.
2. Uniform electrical and mechanical performance is ideal for complex multilayer high frequency structures.
3. Excellent mechanical properties over a wide range of dielectric constants are ideal for multilayer board designs.
4. Excellent dimensional stability for high production yields.
5. Economically priced for volume manufacturing.
Typical Applications:
1. Base Station Infrastructure
2. Wireless Telecommunications Systems
PCB Capability (RO3203)
| PCB Material: | Ceramic-filled Laminates Reinforced with Woven Fiberglass |
| Designation: | RO3203 |
| Dielectric constant: | 3.02±0.04 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
Data Sheet of RO3203
| RO3203 Typical Value | |||||
| Property | RO3203 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.02±0.04 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Dissipation Factor,tanδ | 0.0016 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Conductivity | 0.47 (3.2) | W/mK | Float 100℃ | ASTM C518 | |
| Volume Resistivity | 107 | MΩ.cm | A | ASTM D257 | |
| Surface Resistivity | 107 | MΩ | A | ASTM D257 | |
| Dimensional Stability | 0.08 | X, Y | mm/m +E2/150 | after etch | IPC-TM-650 2.4.3.9 |
| Tensile Modulus | X Y | kpsi | RT | ASTM D638 | |
| Flexural Modulus | 400 300 | X Y | kpsi | A | ASTM D790 |
| Tensile Strength | 12.5 13 | X Y | kpsi | RT | ASTM D638 |
| Flexural Strength | 9 8 | X Y | kpsi | A | ASTM D790 |
| Moisure Absorption | <0.1 | % | D24/23 | IPC-TM-650 2.6.2.1 | |
| Coefficient of Thermal Expansion | 58 13 | Z X,Y | ppm/℃ | -50 ℃to 288℃ | ASTM D3386 |
| Td | 500 | ℃ | TGA | ASTM D3850 | |
| Density | 2.1 | gm/cm3 | 23℃ | ASTM D792 | |
| Copper Peel Stength | 10 (1.74) | lbs/in (N/mm) | After solder | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-Free Process Compatible | Yes | ||||