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4-layer Rogers High Frequency PCB Board Built On 16mil RO4003C for LNB’s for Direct Broadcast Satellites
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Hi Everyone,
Today, we’re going to talk about 2 types of 4-layer high frequency PCB made on 16mil core of RO4003C.
The board is designed as a 4-layer structure, because 4-layer PCB is relatively simple and inexpensive, which is helpful to open up a new market.
Let’s see the stack-up first.
Viewing from stack up, we can see the 1st layer to the 2nd layer and 4th layer to 3rd layer are 12mil core of RO4003C and 16mil core of RO4003C, the core has fixed thickness which is very important to the electrical length of RF lines on the circuit board, and the 2 cores are bonded by bonding film -Prepreg.
At present, there’re 2 types of PP used in multi-layer high frequency PCB’s. That is FR-4 dielectric and high frequency dielectric, such as RO4450F, Cuclad 6250, Taconic’s FastRise-28 (FR-28) etc.
Copper weight on inner layer is half ounces, outer layers 1 ounce. Blind vias are drilled on both cores.
The 2nd board is a mixed PCB, FR-4 is used on layer 3 and layer 4, high frequency signal transmit on high frequency substrate: L1 and L2. According to the actual applications, the thickness of dielectric material and FR-4 can be adjusted.
The application of 16mil RO4003C hybrid PCB is wide, such as modular oscilloscope, antenna combiner, balanced amplifier, 4G antenna etc.
The advantages of 16mil RO4003C hybrid PCB are shown as follows:
1) RO4003C exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications.
2) Reducing signal loss in high frequency application meets the development needs of communication technology.
3) Cost reduced over stack-ups with all low loss material;
Standard thickness of RO4003C are 0.008” (0.203mm), 0.012” (0.305mm), 0.016” (0.406mm), 0.020” (0.508mm), 0.032” (0.813mm) and 0.060” (1.524mm). These thickness are available in house. Welcome your patronage.
Data Sheet of Rogers 4003C (RO4003C)
| RO4003C Typical Value | |||||
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.55 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0027 0.0021 | Z | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 x 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850) 19,450(2,821) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2) 100(14.5) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276 (40) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m (mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11 14 46 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.71 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
| Density | 1.79 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 1.05 (6.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||