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Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
ThunderClad 2 ( TU-883 ) is a very low loss category material based on a high performance resin. This material is reinforced with regular woven E-glass and designed with very low dielectric constant and dissipation factor resin system for high speed low loss, radio frequency and wireless applications. ThunderClad 2 material is suitable for environmental protection lead free process and also compatible with FR-4 processes. ThunderClad 2 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability and CAF resistance.
Typical Properties of TU-883
| Typical Values | Test Condition | SPEC | |
| Thermal | |||
| Tg (DMA) | 220 °C | ||
| Tg (TMA) | 170 °C | E-2/105+des | N/A |
| Td (TGA) | 420 °C | ||
| CTE z-axis α1 | 35 ppm/°C | Pre-Tg | < 60 ppm/°C |
| CTE z-axis α2 | 240 ppm/°C | Post-Tg | < 300 ppm/°C |
| CTE z-axis | 2.50% | 50 to 260°C | < 3.0% |
| Thermal Stress, Solder Float, 288°C | > 60 sec | A | > 10 sec |
| T-260 | > 60 min | > 30 min | |
| T-288 | > 60 min | E-2/105+des | > 15 min |
| T-300 | > 60 min | ||
| Flammability | 94V-0 | E-24/125+des | 94V-0 |
| Electrical | |||
| Permittivity (RC63%) | |||
| 1GHz (SPC method) | 3.60 | ||
| 5GHz (SPC method) | 3.58 | C-24/23/50 | N/A |
| 10GHz (SPC method) | 3.57 | ||
| Loss Tangent (RC63%) | |||
| 1GHz (SPC method) | 0.0030 | ||
| 5GHz (SPC method) | 0.0037 | C-24/23/50 | N/A |
| 10GHz (SPC method) | 0.0046 | ||
| Volume Resistivity | > 1010 MΩ•cm | C-96/35/90 | > 106 MΩ•cm |
| Surface Resistivity | > 108 MΩ | C-96/35/90 | > 104 MΩ |
| Electric Strength | > 40 KV/mm | - | > 30 KV/mm |
| Dielectric Breakdown Voltage | > 50 KV | - | > 40 KV |
| Mechanical | |||
| Young’s Modulus | |||
| Warp Direction | 28 GPa | A | N/A |
| Fill Direction | 26 GPa | ||
| Flexural Strength | |||
| Lengthwise | > 60,000 psi | A | > 60,000 psi |
| Crosswise | > 50,000 psi | A | > 50,000 psi |
| Peel Strength, 1.0 oz. Cu foil | 4~6 lb/in | A | > 4 lb/in |
| Water Absorption | 0.08% | E-1/105+des+D-24/23 | < 0.8 % |
Performance and Processing Advantages
Excellent electrical properties
Dielectric constant less than 4.0
Dissipation factor less than 0.005
Stable and flat Dk/Df performance over frequency and temperature
Compatible with modified FR-4 processes
Excellent moisture resistance and Lead Free reflow process compatible
Improved z-axis thermal expansion
Anti-CAF capability
Excellent through-hole and soldering reliability
Halogen Free
Our PCB Capabilities (TU-883)
| PCB Material: | High Temperature Resin |
| Designation: | TU-883 |
| Dielectric constant: | 3.60 at 1GHz |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm) |
| PCB thickness: | 0.5mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc.. |
| Technology: | HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc. |
Applications
Radio frequency
Backplane, High performance computing
Line cards, Storage
Servers, Telecom, Base station, Office Routers