Bicheng Electronics Technology Co., Ltd
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RF-35 Taconic High Frequency PCB with DK 3.5 Tg 315℃ 10mil 20mil 30mil 60mil RF PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RF-35 is an organic-ceramic laminate material in the ORCER (Organic Ceramic) family of Taconic products. It is based on woven glass reinforcement. RF-35 is the result of Taconic's expertise in both ceramic filling technology and coated polytetrafluoride (PTFE) fiberglass.
RF-35 is the best choice for low cost, high volume commercial microwave and radio frequency applications.It has an excellent peel strength for 1/2 ounce and 1 ounce copper (even compared to standard epoxy glass), a key aspect of the need for rework.
RF-35's Tg exceeds 315 ℃. Its ultra low moisture absorption rate and low dissipation factor minimize phase shift with frequency. RF-35 used woven fabrics in the design result in the stable dimension. The laminates are usually orderly clad on one side or both sides with 1/2,1 and 2 ounces electrodeposited copper respectively.
So we benefit from its low cost, excellent peel strength, exceptionally low dissipation factor, low moisture absorption and enhanced surface smoothness.
Applications
Power Amplifiers
Filters and Couplers
Passive Components
Our PCB Capability (RF-35)
| PCB Material: | PTFE Ceramic Fiberglass |
| Designation: | RF-35 |
| Dielectric constant: | 3.5 |
| Dissipation Factor | 0.0018 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc.. |
RF-35 Typical Value
| Property | Test Method | Unit | Value | Unit | Value |
| Dielectric Constant @ 1.9 GHz | IPC-TM 650 2.5.5 | 3.5 | 3.5 | ||
| Dissipation Factor @ 1.9 GHz | IPC-TM 650 2.5.5 | 0.0018 | 0.0018 | ||
| Moisture Absorption (.060") | IPC-TM 650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Peel Strength (1/2 oz. copper) | IPC-TM 650 2.4.8 | lbs./linear inch | >8.0 | N/mm | >1.5 |
| Peel Strength (1 oz. copper) | IPC-TM 650 2.4.8 | lbs./linear inch | >10.0 | N/mm | >1.8 |
| Dielectric Breakdown | IPC-TM 650 2.5.6 | kV | 41 | kV | 41 |
| Volume Resistivity | IPC-TM 650 2.5.17.1 | Mohm/cm | 1.26 x 109 | Mohm/cm | 1.26 x 109 |
| Surface Resistivity | IPC-TM 650 2.5.17.1 | Mohm | 1.46 x 108 | Mohm | 1.46 x 108 |
| Arc Resistance | IPC TM 650 2.5.1 | seconds | >180 | seconds | >180 |
| Flexural Strength Lengthwise | ASTM D 790 | psi | >22,000 | N/mm2 | >152 |
| Flexural Strength Crosswise | ASTM D 790 | psi | >18,000 | N/mm2 | >124 |
| Thermal Conductivity | ASTM F 433 | W/m/K | 0.24 | W/m/K | 0.24 |
| Tensile Strength Lengthwise | ASTM D 638 | psi | 27,000 | N/mm2 | 187 |
| Tensile Strength Crosswise | ASTM D 638 | psi | 21,000 | N/mm2 | 145 |
| Dimensional Stability Lengthwise | IPC-TM 650 2.4.39 | in/in | 0.00004 | mm/mm | 0.00004 |
| Dimensional Stability Crosswise | IPC-TM 650 2.4.39 | in/in | -0.0001 | mm/mm | -0.0001 |
| x-y CTE | ASTM D 3386 (TMA) | ppm/°C | 19-24 | ppm/°C | 19-24 |
| z CTE | ASTM D 3386 (TMA) | ppm/°C | 64 | ppm/°C | 64 |
| Flammability | UL-94 | V-0 | V-0 | ||
| Hardness | Rockwell M Scale | 34 | 34 |
| Type | Dk | |
| TLY-5A | 2.17 | |
| TLY-5 | 2.20 | |
| TLY-3 | 2.33 | |
| TLT-0 | TLX-0 | 2.45 |
| TLT-9 | TLX-9 | 2.50 |
| TLT-8 | TLX-8 | 2.55 |
| TLT-7 | TLX-7 | 2.60 |
| TLT-6 | TLX-6 | 2.65 |
| TLE-95 | 2.95 | |
| TLC-27 | 2.75 | |
| TLC-30 | 3.00 | |
| TLC-32 | 3.20 | |
| RF-30 | 3.00 | |
| RF-35 | RF-35P | 3.50 |
| RF-60 | 6.15 | |
| CER-10 | 10 | |
