Bicheng Electronics Technology Co., Ltd

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SCGA-500 GF265 High Frequency Hybrid PCB High Tg FR-4 With Immersion Gold

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Bicheng Electronics Technology Co., Ltd
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City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MsIvy Deng
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SCGA-500 GF265 High Frequency Hybrid PCB High Tg FR-4 With Immersion Gold

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Brand Name :Bicheng
Model Number :BIC-204.V1.0
Certification :UL, ISO9001, IATF16949
Place of Origin :CHINA
MOQ :1PCS
Price :USD9.99-99.99
Payment Terms :T/T
Supply Ability :5000PCS per month
Delivery Time :8-9 working days
Packaging Details :Vacuum bags+Cartons
Based material :SCGA-500 GF265 0.51mm, FR-4 Tg170℃
Layer count :4 layers
PCB thickness :1.2 mm ±0.12
PCB size :155mm x 100mm=2pcs=2types
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Hybrid PCB Built on SCGA-500 GF265 High Frequency Material and High Tg FR-4 With Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General Description

This is a type of 4-layer hybrid PCB mixed SCGA-500 GF265 and Tg170℃ FR-4 with 1oz copper on each layer, finished thickness at 1.2mm. Surface finish on pads is immersion gold. Green solder mask protects the track patterns. It contains 2 different boards in the panel. PCB boards are manufactured strictly as per required specifications with the standard IPC-Class-II. Each board is 100% tested before shipment. 25 boards are vacuum packed for delivery.

SCGA-500 GF265 High Frequency Hybrid PCB High Tg FR-4 With Immersion Gold

PCB Specifications

PCB SIZE 155mm x 100mm=2pcs=2types
BOARD TYPE Hybrid PCB
Number of Layers 4 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 17um(0.5 oz)+plate top layer
SCGA-500 GF265 0.51mm
copper ------- 35um
Prepreg 0.100mm
copper ------- 35um
FR-4 Tg170℃
copper ------- 17um(0.5 oz)+plate bottom layer
TECHNOLOGY
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.3 mm / 0.9 mm
Number of Different Holes: 6
Number of Drill Holes: 39
Number of Milled Slots: 2
Number of Internal Cutouts: 2
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: SCGA-500 GF265 + Tg170℃ FR-4
Final foil external: 1.0 oz
Final foil internal: 1.0 oz
Final height of PCB: 1.2 mm ±0.12
PLATING AND COATING
Surface Finish Immersion Gold, 78.2%
Solder Mask Apply To: Both sides
Solder Mask Color: Green
Solder Mask Type: Glossy
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend Top side
Colour of Component Legend White
Manufacturer Name or Logo: Kuangshung
VIA Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING 94V-0
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Our Advantages

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, servicing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 19 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We also actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.

SCGA-500 GF265 High Frequency Hybrid PCB High Tg FR-4 With Immersion Gold

Our PCB Capability(2022)

Parameter Value
 Layer Counts  1-32
 Substrate Materials RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; RT/duroid 5880LZ; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; DiClad 880, DiClad 870, DiClad 527, IsoClad 917; Nelco N4000, N9350, N9240; SCGA-500 GF220, SCGA-500 GF255, SCGA-500 GF265, SCGA-500 GF300; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
 Maximum Size  Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
 Board Outline Tolerance  ±0.0059" (0.15mm)
 PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)  ±8%
Thickness Tolerance(t<0.8mm)  ±10%
 Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
 Minimum Track 0.003" (0.075mm)
 Minimum Space  0.003" (0.075mm)
 Outer Copper Thickness  35µm--350µm (1oz-10oz)
 Inner Copper Thickness  17µm--350µm (0.5oz - 10oz)
 Drill Hole(Mechanical) 0.0079" - 0.25" (0.2mm--6.35mm)
 Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
 Registration (Mechanical) 0.00197" (0.05mm)
 Aspect Ratio  12:1
 Solder Mask Type  LPI
 Min Soldermask Bridge 0.00315" (0.08mm)
 Min Soldermask Clearance 0.00197" (0.05mm)
 Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance  ±10%
 Surface Finish HASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc.

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