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Rogers RT/Duroid 5870 10mil 0.254mm High Frequency PCB for Commercial Aireline Broadband Antennas
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers RT/duroid 5870 high frequency material is glass microfiber reinforced PTFE composites which is designed for exacting stripline and microstrip circuit applications. The exceptional dielectric constant uniformity results from its randomly oriented microfibers. The dielectric constant of RT/duroid 5870 is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5870 to Ku-band and above. RT/duroid 5870 materials are easily cut, sheared and machined to shape. They are resistant to all solvents and reagents, hot or cold, normally used in etching printed circuits or in plating edges and holes.
The typical applications are commercial airline broadband antennas, microstrip circuits, stripline circuits, millimeter wave applications, military radar systems, missile guidance systems and point to point digital radio antennas etc.
| PCB SIZE | 100 x 68mm=1up |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 35um(1 oz)+plate TOP layer |
| RT/duroid 5870 0.254mm | |
| copper ------- 35um(1oz) + plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 8.8 mil / 10.5mil |
| Minimum / Maximum Holes: | no |
| Number of Different Holes: | no |
| Number of Drill Holes: | no |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | RT/duroid 5870 0.254mm |
| Final foil external: | 1oz |
| Final foil internal: | N/A |
| Final height of PCB: | 0.3 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | OSP |
| Solder Mask Apply To: | N/A |
| Solder Mask Color: | N/A |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | N/A |
| Colour of Component Legend | N/A |
| Manufacturer Name or Logo: | N/A |
| VIA | NO |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
| RT/duroid 5870 Typical Value | ||||||
| Property | RT/duroid 5870 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 2.33 2.33±0.02 spec. | Z | N/A | C24/23/50 C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 | |
| Dielectric Constant,εDesign | 2.33 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0005 0.0012 | Z | N/A | C24/23/50 C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 | |
| Thermal Coefficient of ε | -115 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 | |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 | |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 | |
| Specific Heat | 0.96(0.23) | N/A | j/g/k (cal/g/c) | N/A | Calculated | |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1300(189) | 490(71) | X | ||||
| 1280(185) | 430(63) | Y | ||||
| Ultimate Stress | 50(7.3) | 34(4.8) | X | |||
| 42(6.1) | 34(4.8) | Y | ||||
| Ultimate Strain | 9.8 | 8.7 | X | % | ||
| 9.8 | 8.6 | Y | ||||
| Compressive Modulus | 1210(176) | 680(99) | X | MPa(kpsi) | A | ASTM D 695 |
| 1360(198) | 860(125) | Y | ||||
| 803(120) | 520(76) | Z | ||||
| Ultimate Stress | 30(4.4) | 23(3.4) | X | |||
| 37(5.3) | 25(3.7) | Y | ||||
| 54(7.8) | 37(5.3) | Z | ||||
| Ultimate Strain | 4 | 4.3 | X | % | ||
| 3.3 | 3.3 | Y | ||||
| 8.7 | 8.5 | Z | ||||
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 | |
| Thermal Conductivity | 0.22 | Z | W/m/k | 80℃ | ASTM C 518 | |
| Coefficient of Thermal Expansion | 22 28 173 | X Y Z | ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 | |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 | |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 | |
| Copper Peel | 27.2(4.8) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil after solder float | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 | |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A | |
