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Rogers RT/Duroid 6006 High Frequency PCB
Rogers RT/duroid 6006 microwave laminates are ceramic-PTFE composites which are designed for electronic and microwave circuit applications requiring a high dielectric constant. RT/duroid 6006 laminate is available with a dielectric constant value of 6.15.
RT/duroid 6006 microwave laminates feature ease of fabrication and stability in use. This property results in the possibility of mass production and reducing the cost of goods. It has tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.
RT/Duroid 6006 printed circuit boards are widely used in aircraft collision avoidance systems, ground radar warning systems, patch antennas and satellite communications systems etc.
| RT/duroid 6006 Typical Value | |||||
| Property | RT/duroid 6006 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 6.15±0.15 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped stripline | |
| Dielectric Constant,εDesign | 6.45 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0027 | Z | 10 GHz/A | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -410 | Z | ppm/℃ | -50℃-170℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 7 x 107 | Mohm.cm | A | IPC 2.5.17.1 | |
| Surface Resistivity | 2 x 107 | Mohm | A | IPC 2.5.17.1 | |
| Tensile Properties | ASTM D638 (0.1/min. strain rate) | ||||
| Young's Modulus | 627(91) 517(75) | X Y | MPa(kpsi) | A | |
| Ultimate Stress | 20(2.8) 17(2.5) | X Y | MPa(kpsi) | A | |
| Ultimate Strain | 12 to 13 4 to 6 | X Y | % | A | |
| Compressive Properties | ASTM D695 (0.05/min. strain rate) | ||||
| Young's Modulus | 1069 (115) | Z | MPa(kpsi) | A | |
| Ultimate Stress | 54(7.9) | Z | MPa(kpsi) | A | |
| Ultimate Strain | 33 | Z | % | ||
| Flexural Modulus | 2634 (382) 1951 (283) | X | MPa(kpsi) | A | ASTM D790 |
| Ultimate Stress | 38 (5.5) | X Y | MPa(kpsi) | A | |
| Deformation under load | 0.33 2.1 | Z Z | % | 24hr/50℃/7MPa 24hr/150℃/7MPa | ASTM D261 |
| Moisture Absorption | 0.05 | % | D48/50℃ 0.050"(1.27mm) thick | IPC-TM-650 2.6.2.1 | |
| Thermal Conductivity | 0.49 | W/m/k | 80℃ | ASTM C518 | |
| Coefficient of Thermal Expansion | 47 34 117 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | ℃ TGA | ASTM D3850 | ||
| Density | 2.7 | g/cm3 | ASTM D792 | ||
| Specific Heat | 0.97(0.231) | j/g/k (BTU/ib/OF) | Calculated | ||
| Copper Peel | 14.3 (2.5) | pli (N/mm) | after solder float | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||