Bicheng Electronics Technology Co., Ltd

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4mil Rogers 4350 Double Sided RF Circuit Board PCB 0.101mm Thick

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Bicheng Electronics Technology Co., Ltd
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City:shenzhen
Province/State:guangdong
Country/Region:china
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4mil Rogers 4350 Double Sided RF Circuit Board PCB 0.101mm Thick

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Brand Name :Bicheng
Model Number :BIC-1.V1.0
Certification :UL, ISO9001, IATF16949
Place of Origin :CHINA
MOQ :1PCS
Price :USD9.99-99.99
Payment Terms :T/T
Supply Ability :5000PCS per month
Delivery Time :8-9 working days
Packaging Details :Vacuum bags+Cartons
Based material :RO4350B
Thickness :4 mil
PCB size :≤400mm X 500mm
Surface finish :Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..
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4mil rogers 4350 double sided RF circuit board

Hydrocarbon ceramic laminates with the part number RO4350B are intended to provide improved high frequency performance and inexpensive circuit manufacturing. Once working frequencies reach 500 MHz and beyond, designers have a much smaller number of laminates to choose from.

Rogers 4350 have wide thickness. Such as 10 mils, 20 mils, 30 mils etc. The wide thickness range can meet the customer's requries in multipul thickness design.

Main applications:

Automotive Radar and Sensors

Cellular Base Station Antennas

Direct Broadcast Satellites

RO4350B Typical Value
Property RO4350B Direction Units Condition Test Method
Dielectric Constant,εProcess 3.48±0.05 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.66 Z 8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0037
0.0031
Z 10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +50 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.2 x 1010 MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 5.7 x109 COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 16,767(2,432)
14,153(2,053)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 203(29.5)
130(18.9)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 255
(37)
MPa
(kpsi)
IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 10
12
32
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280 ℃ TMA A IPC-TM-650 2.4.24.3
Td 390 ℃ TGA ASTM D 3850
Thermal Conductivity 0.69 W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06 % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.86 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 0.88
(5.0)
N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability (3)V-0 UL 94
Lead-free Process Compatible Yes

4mil Rogers 4350 Double Sided RF Circuit Board PCB 0.101mm Thick

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