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We are delighted to introduce our latest shipment of PCB, meticulously crafted to meet your technological demands. This rigid 2-layer PCB exemplifies excellence in material selection and construction, making it a reliable choice for a wide array of applications. Explore the remarkable features and specifications:
1. PCB Material:
- Impeccable Quality: Crafted from Rogers RT/duroid 5880, a cutting-edge glass microfiber reinforced PTFE composite, ensuring top-notch performance.
- Superior Dielectric Properties: Process DK 2.2 at 10 GHz/23°C facilitates efficient signal transmission, guaranteeing seamless connectivity.
- Minimal Signal Loss: With a dissipation factor of 0.0009 at 10 GHz/23°C, experience minimal interference and optimal signal integrity.
- Exceptional Durability: Withstanding temperatures above 500°C (Td > 500°C), this PCB is built to last in demanding environments.
- Versatile Operating Range: Designed to operate flawlessly between -40℃ to +85℃, providing adaptability to diverse conditions.
2. Impeccable Construction:
- Sturdy Foundation: The 2-layer rigid design ensures structural integrity for optimal performance and longevity.
- Copper Layer Thickness: Enjoy a 35 μm thickness on both Copper Layer 1 and Copper Layer 2, enabling efficient electrical conductivity.
3. Detailed Specifications:
- Compact Dimensions: The PCB measures 41.56mm x 43.19mm, with a tolerance of +/- 0.15mm, offering a compact yet reliable solution for your applications.
- Precise Electrical Connections: Achieve precise trace/space requirements with a minimum of 4/6 mils, ensuring accurate signal routing.
- Component Adaptability: Accommodates components with a minimum hole size of 0.4mm, allowing flexibility in component selection.
- Reliable Via Connections: Utilizes 79 vias for robust electrical connections and efficient signal routing.
- Superior Plating: The 20 μm via plating thickness guarantees excellent conductivity and durability.
- Optimal Surface Finish: Enjoy the advantages of immersion gold surface finish, providing optimal conductivity and corrosion resistance.
- Streamlined Design: No top or bottom silkscreen, keeping the focus on functionality and simplicity.
- Enhanced Protection: Features green solder mask on the top side and no solder mask on the bottom side, safeguarding components from external elements.
- Rigorous Quality Assurance: Each PCB undergoes a 100% electrical test before shipment, ensuring reliability and performance.
4. PCB Statistics:
- Component Versatility: The PCB accommodates up to 51 components, offering ample flexibility for your circuit design needs.
- Seamless Integration: Benefit from 88 pads, including 63 thru-hole pads and 25 top surface mount technology (SMT) pads, for effortless component integration and efficient assembly.
- Efficient Signal Transmission: Supports 3 nets, guaranteeing smooth and reliable signal flow.
5. Artwork Format: The supplied artwork is compatible with the Gerber RS-274-X format, ensuring seamless integration with standard PCB manufacturing processes.
6. Adhering to Industry Standards: This PCB adheres to IPC-Class-2, meeting stringent quality and reliability standards.
7. Global Availability: Our PCBs are readily available worldwide, enabling customers from all corners of the globe to access our exceptional products.
For any technical inquiries or further assistance, please don't hesitate to reach out to Ivy at sales10@bichengpcb.com. Our dedicated team is committed to providing exceptional support and ensuring your utmost satisfaction with our products.
Dielectric Constant,εProcess | 2.20 2.20±0.02 spec. | Z | N/A | C24/23/50 C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 | |
Dielectric Constant,εDesign | 2.2 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor,tanδ | 0.0004 0.0009 | Z | N/A | C24/23/50 C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 | |
Thermal Coefficient of ε | -125 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 | |
Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 | |
Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 | |
Specific Heat | 0.96(0.23) | N/A | j/g/k (cal/g/c) | N/A | Calculated | |
Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
1070(156) | 450(65) | X | ||||
860(125) | 380(55) | Y | ||||
Ultimate Stress | 29(4.2) | 20(2.9) | X | |||
27(3.9) | 18(2.6) | Y | ||||
Ultimate Strain | 6 | 7.2 | X | % | ||
4.9 | 5.8 | Y | ||||
Compressive Modulus | 710(103) | 500(73) | X | MPa(kpsi) | A | ASTM D 695 |
710(103) | 500(73) | Y | ||||
940(136) | 670(97) | Z | ||||
Ultimate Stress | 27(3.9) | 22(3.2) | X | |||
29(5.3) | 21(3.1) | Y | ||||
52(7.5) | 43(6.3) | Z | ||||
Ultimate Strain | 8.5 | 8.4 | X | % | ||
7.7 | 7.8 | Y | ||||
12.5 | 17.6 | Z | ||||
Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 | |
Thermal Conductivity | 0.2 | Z | W/m/k | 80℃ | ASTM C 518 | |
Coefficient of Thermal Expansion | 31 48 237 | X Y Z | ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 | |
Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 | |
Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 | |
Copper Peel | 31.2(5.5) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil after solder float | IPC-TM-650 2.4.8 | |
Flammability | V-0 | N/A | N/A | N/A | UL 94 | |
Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A |
RT/duroid 5880: A Comprehensive Overview of Properties and Applications for High-Frequency PCBs
Let's look at the details about the properties and characteristics of this advanced material used in printed circuit boards (PCBs). It exhibits a dielectric constant of 2.20 (with a range of 2.20±0.02), indicating its ability to store electrical energy. The dissipation factor (tan δ) ranges from 0.0004 to 0.0009, showing its capacity to dissipate electrical energy as heat.
With a thermal coefficient of ε of -125 ppm/℃, RT/duroid 5880 experiences a decrease in dielectric constant as temperature rises within the range of -50℃ to 150℃. It also demonstrates high volume and surface resistivity, measuring 2 x 10^7 Mohm cm and 3 x 10^7 Mohm, respectively, ensuring effective insulation and preventing electrical charge leakage.
RT/duroid 5880 has a specific heat of 0.96 j/g/k (0.23 cal/g/c), representing the amount of heat required to raise its temperature. Mechanically, it possesses strong tensile and compressive moduli. The tensile modulus at 23℃ is 1070 MPa (156 kpsi) in the X direction and 450 MPa (65 kpsi) in the Y direction. The compressive modulus values are 710 MPa (103 kpsi) in the X and Y directions and 940 MPa (136 kpsi) in the Z direction.
The ultimate stress values range from 18 to 29 MPa (2.6 to 4.2 kpsi) in the X and Y directions, and the ultimate strain ranges from 4.9% to 7.2%. RT/duroid 5880 exhibits low moisture absorption of 0.02%, ensuring minimal water absorption even in moist conditions.
With a thermal conductivity of 0.2 W/m/k at 80℃, it efficiently conducts heat. The coefficient of thermal expansion is 31 ppm/℃ (X), 48 ppm/℃ (Y), and 237 ppm/℃ (Z) within the temperature range of 0-100℃, indicating its expansion or contraction with temperature changes.
Other notable properties include a decomposition temperature (Td) of 500℃, density of 2.2 gm/cm3, copper peel strength of 31.2 pli (5.5 N/mm), and a flammability rating of V-0 according to UL 94. RT/duroid 5880 is also compatible with lead-free processes.
These specifications make RT/duroid 5880 an ideal choice for high-frequency PCB applications, where low loss, excellent electrical insulation, and mechanical stability are critical factors.