Bicheng Electronics Technology Co., Ltd
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Today, we are happy to share our newly shipped PCB with you. A cutting-edge solution supplied to meet the demanding requirements of high-performance applications. With its woven fiberglass reinforced, ceramic filled, PTFE-based composite material, this PCB offers exceptional thermal conductivity, dielectric stability, and reliability across a wide temperature range.
Key Features:
- "Best in Class" Thermal Conductivity (1.0 W/mK) and Dielectric Constant Stability (-9 ppm/°C) ensure efficient heat dissipation and reliable signal transmission even in challenging environments.
- Very Low Loss Tangent provides higher amplifier or antenna efficiency, enabling superior performance in critical applications.
- Priced affordably for commercial applications, making it an accessible solution without compromising on quality or performance.
- Easier to drill than traditional commercial-based laminates, thanks to its thick and dense style woven glass construction.
- High Peel Strength ensures reliable copper adhesion, crucial for thermally stressed applications.
Construction Details:
This 2-layer rigid PCB features a TC350 Core with copper layers on both sides. The board dimensions are 98mm x 81mm, allowing for compact and efficient designs. With a finished board thickness of 0.6mm and a finished copper weight of 1oz (1.4 mils) on the outer layers, this PCB strikes the perfect balance between performance and flexibility. The PCB is finished with immersion tin surface coating, providing excellent solderability and corrosion resistance.
Benefits:
- Heat Dissipation and Management: The exceptional thermal conductivity of this PCB enables efficient heat dissipation, preventing overheating and ensuring optimal performance even in demanding applications.
- Improved Processing and Reliability: With its low loss tangent and dielectric stability, this PCB enhances signal integrity, reduces loss, and improves overall system reliability.
- Large Panel Sizes for Multiple Circuit Layout: This PCB allows for multiple circuit layouts within a single panel, reducing processing costs and maximizing efficiency.
Typical Applications:
- Power Amplifiers, Filters, and Couplers: This PCB is ideal for high-power applications that require efficient heat dissipation and reliable signal transmission.
- Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB): With its excellent thermal management properties, this PCB ensures reliable performance in tower-mounted applications.
- Thermally Cycled Antennas: The PCB's dielectric stability makes it suitable for antennas sensitive to dielectric drift caused by temperature variations.
- Microwave Combiner and Power Dividers: This PCB provides the performance and reliability needed for microwave combiners and power dividers in demanding environments.
Quality and Support:
Our PCBs adhere to IPC-Class-2 quality standards, ensuring high reliability and performance. We provide worldwide availability and offer technical support for any inquiries or assistance required. For technical questions, please contact Ivy at sales10@bichengpcb.com.
| Property | Units | Value | Test Merthod |
| 1. Electrical Properties | |||
| Dielectric Constant (may vary by thickness) | |||
| @1 MHz | － | 3.50 | IPC TM-650 2.5.5.3 |
| @1.8 GHz | － | 3.50 | RESONANT CAVITY |
| @10 GHz | － | 3.50 | IPC TM-650 2.5.5.5 |
| Dissipation Factor | |||
| @1 MHz | － | 0.0015 | IPC TM-650 2.5.5.3 |
| @1.8 GHz | － | 0.0018 | RESONANT CAVITY |
| @10 GHz | － | 0.0020 | IPC TM-650 2.5.5.5 |
| Temperature Coefficient of Dielectric | － | ||
| TC r @ 10 GHz (-40-150°C) | ppm/ºC | -9 | IPC TM-650 2.5.5.5 |
| Volume Resistivity | |||
| C96/35/90 | MΩ-cm | 7.4x106 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ-cm | 1.4x108 | |
| Surface Resistivity | |||
| C96/35/90 | MΩ | 3.2x107 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ | 4.3x108 | IPC TM-650 2.5.17.1 |
| Electrical Strength | Volts/mil (kV/mm) | 780 (31) | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | kV | 40 | IPC TM-650 2.5.6 |
| Arc Resistance | sec | >240 | IPC TM-650 2.5.1 |
| 2.Thermal Properties | |||
| Decomposition Temperature (Td) | |||
| Initial | °C | 520 | IPC TM-650 2.4.24.6 |
| 5% | °C | 567 | IPC TM-650 2.4.24.6 |
| T260 | min | >60 | IPC TM-650 2.4.24.1 |
| T288 | min | >60 | IPC TM-650 2.4.24.1 |
| T300 | min | >60 | IPC TM-650 2.4.24.1 |
| Thermal Expansion, CTE (x,y) 50-150ºC | ppm/ºC | 7, 7 | IPC TM-650 2.4.41 |
| Thermal Expansion, CTE (z) 50-150ºC | ppm/ºC | 12 | IPC TM-650 2.4.24 |
| % z-axis Expansion (50-260ºC) | % | 1.2 | IPC TM-650 2.4.24 |
| 3. Mechanical Properties | |||
| Peel Strength to Copper (1 oz/35 micron) | |||
| After Thermal Stress | lb/in (N/mm) | 7 (1.2) | IPC TM-650 2.4.8 |
| At Elevated Temperatures (150ºC) | lb/in (N/mm) | 9 (1.6) | IPC TM-650 2.4.8.2 |
| After Process Solutions | lb/in (N/mm) | 7 (1.2) | IPC TM-650 2.4.8 |
| Young’s Modulus | kpsi (MPa) | IPC TM-650 2.4.18.3 | |
| Flexural Strength (Machine/Cross) | kpsi (MPa) | 14/10 (97/69) | IPC TM-650 2.4.4 |
| Tensile Strength (Machine/Cross) | kpsi (MPa) | 11/8 (76/55) | IPC TM-650 2.4.18.3 |
| Compressive Modulus | kpsi (MPa) | ASTM D-3410 | |
| Poisson’s Ratio | － | ASTM D-3039 | |
| 4. Physical Properties | |||
| Water Absorption | % | 0.05 | IPC TM-650 2.6.2.1 |
| Density, ambient 23ºC | g/cm3 | 2.30 | ASTM D792 Method A |
| Thermal Conductivity | W/mK | 0.72 | ASTM D5470 |
| Specific Heat | J/gK | 0.90 | ASTM D5470 |
| Flammability | class | V0 | UL-94 |
| NASA Outgassing, 125ºC, ≤10- 6 torr | |||
| Total Mass Loss | % | 0.02 | NASA SP-R-0022A |
| Collected Volatiles | % | 0.01 | NASA SP-R-0022A |
| Water Vapor Recovered | % | 0.01 | NASA SP-R-0022A |
Unleashing the Power of TC350 PCB: Redefining High-Frequency Performance
Welcome to the world of TC350, an exceptional PCB designed to revolutionize high-frequency applications. In this article, we will explore the key features, benefits, and applications of TC350, backed by the data sheet. With its advanced electrical and thermal properties, TC350 sets a new benchmark for performance and reliability. Let's dive into the details and discover how TC350 can empower your high-frequency projects.
TC350 is a cutting-edge PCB that combines innovative design and advanced materials to deliver superior performance in high-frequency applications. With its exceptional electrical properties, TC350 ensures reliable signal transmission, minimal signal loss, and reduced crosstalk.
Let's see the following key properties of TC350:
1. Electrical Properties
TC350 exhibits a consistent dielectric constant of 3.50 across a wide frequency range, ensuring precise signal propagation and minimal distortions. Its low dissipation factor of 0.0015 at 1 MHz minimizes energy losses and enhances signal integrity even at high frequencies.
2. Thermal Properties
TC350 excels in thermal management with a high thermal conductivity of 0.72 W/mK. This property allows for efficient heat transfer, preventing overheating and ensuring optimal performance. The PCB also demonstrates exceptional thermal expansion properties, with a low z-axis expansion of 1.2% from 50 to 260oC, guaranteeing dimensional stability even in challenging thermal environments.
3. Mechanical Properties
TC350 boasts impressive mechanical strength, making it suitable for demanding applications. It exhibits excellent peel strength of 7 lb/in after thermal stress and meets industry standards for young's modulus. The PCB's flexural and tensile strengths of 14/10 kpsi (97/69 MPa) and 11/8 kpsi (76/55 MPa) respectively further enhance its mechanical integrity.
4. Physical Properties
In addition to its electrical and thermal prowess, TC350 showcases remarkable physical properties. With a water absorption rate of only 0.05%, it remains dimensionally stable, even in humid conditions. The PCB's density of 2.30 g/cm3 and low flammability rating of V0 according to UL-94 ensure safety and compliance in various environments.
TC350 finds versatile applications in high-frequency projects where performance and reliability are paramount. It enables engineers to push the boundaries of high-frequency technology in power amplifiers, filters, couplers, tower-mounted amplifiers, thermally cycled antennas, and microwave combiners. Whether in telecommunication, aerospace, or industrial sectors, TC350 empowers engineers to design cutting-edge solutions.
In conclusion, TC350 PCB stands as a game-changer in high-frequency applications, offering exceptional electrical, thermal, and mechanical performance. With its stable dielectric constant, efficient heat dissipation, and reliable signal transmission, TC350 enables engineers to design cutting-edge solutions.