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Introduction:
Hello, today we will delve into the fascinating world of advanced substrates for electronic circuits and explore the exceptional properties of AD1000. We'll discuss what sets AD1000 apart from other substrates, its remarkable woven-glass reinforced PTFE material, and how it provides unmatched dimensional stability and mechanical robustness. AD1000 is revolutionizing circuit miniaturization and opening up new possibilities for power amplifiers, filters, couplers, and more. So, let's dive right in!
1. Electrical Properties:
AD1000 boasts exceptional electrical properties. Its dielectric constant varies with thickness, reaching an impressive value of 10.2 at 10 GHz, while the value at 1 MHz is yet to be determined. The dissipation factor is equally remarkable, with a value of 0.0023 at 10 GHz and yet to be determined at 1 MHz.
The temperature coefficient of dielectric constant at 10 GHz is -380 ppm/℃, indicating significant changes in dielectric constant with temperature. If your devices or systems rely on consistent electrical performance, careful material selection is crucial.
AD1000 exhibits outstanding volume resistivity and surface resistivity, showcasing excellent insulation properties. At specific conditions, it demonstrates volume resistivity values of 1.40x10^9 MΩ-cm and 5.36x10^7 MΩ-cm, as well as surface resistivity values of 1.80x10^9 MΩ and 3.16x10^8 MΩ.
According to IPC TM-650 standards, AD1000 withstands an electrical strength of 622 volts per mil, possesses a dielectric breakdown voltage exceeding 45 kV, and demonstrates impressive arc resistance exceeding 180 seconds.
2. Thermal Properties:
AD1000 excels in thermal properties, essential for reliable electronic system operation. It has a high decomposition temperature of over 500℃, enabling it to withstand high-temperature environments without compromising integrity. Additionally, AD1000 exhibits remarkable thermal expansion characteristics, with a CTE (X, Y) of 8 ppm/℃ and 10 ppm/℃ respectively, and a CTE (Z) of 20 ppm/℃ from 50-150ºC.
| Property | Units | AD1000 | Test Method |
| 1. Electrical Properties | |||
| Dielectric Constant (may vary by thickness) @ 10 GHz | - | 10.2 | IPC TM-650 2.5.5.5 |
| Dissipation Factor @ 10 GHz | - | 0.0023 | IPC TM-650 2.5.5.5 |
| Temperature Coefficient of Dielectric Constant, TCεr @ 10 GHz (-40-150°C) | ppm/℃ | -380 | IPC TM-650 2.5.5.5 |
| Volume Resistivity | |||
| C96/35/90 | MΩ-cm | 1.40x109 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ-cm | 5.36x107 | IPC TM-650 2.5.17.1 |
| Surface Resistivity | |||
| C96/35/90 | MΩ | 1.80x109 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ | 3.16x108 | IPC TM-650 2.5.17.1 |
| Electrical Strength | Volts/mil (kV/mm) | 622 (24.5) | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | kV | >45 | IPC TM-650 2.5.6 |
| Arc Resistance | sec | >180 | IPC TM-650 2.5.1 |
| 2. Thermal Properties | |||
| Decomposition Temperature (Td) | |||
| Initial | ℃ | >500 | IPC TM-650 2.4.24.6 |
| 5% | ℃ | >500 | IPC TM-650 2.4.24.6 |
| T260 | min | >60 | IPC TM-650 2.4.24.1 |
| T288 | min | >60 | IPC TM-650 2.4.24.1 |
| T300 | min | >60 | IPC TM-650 2.4.24.1 |
| Thermal Expansion, CTE (X,Y) 50-150ºC | ppm/℃ | 8, 10 | IPC TM-650 2.4.41 |
| Thermal Expansion, CTE (Z) 50-150ºC | ppm/℃ | 20 | IPC TM-650 2.4.24 |
| 3. Mechanical Properties | |||
| Peel Strength to Copper (1 oz/35 micron) | |||
| After Thermal Stress | lb/in (N/mm) | >12 (2.1) | IPC TM-650 2.4.8 |
| At Elevated Temperatures (150º) | lb/in (N/mm) | 13.6 (2.4) | IPC TM-650 2.4.8.2 |
| After Process Solutions | lb/in (N/mm) | IPC TM-650 2.4.8 | |
| Young’s Modulus | kpsi (GPa) | 200 (1.38) | IPC TM-650 2.4.18.3 |
| Flexural Strength (Machine/Cross) | kpsi (MPa) | 9.9/7.5 (68/52) | IPC TM-650 2.4.4 |
| Tensile Strength (Machine/Cross) | kpsi (MPa) | 5.1/4.3 (35/30) | IPC TM-650 2.4.18.3 |
| Compressive Modulus | kpsi (GPa) | >425 (>2.93) | ASTM D-3410 |
| Poisson’s Ratio | - | 0.16 | ASTM D-3039 |
| 4. Physical Properties | |||
| Water Absorption | % | 0.03 | IPC TM-650 2.6.2.1 |
| Density, ambient 23ºC | g/cm3 | 3.20 | ASTM D792 Method A |
| Thermal Conductivity | W/mK | 0.81 | ASTM E1461 |
| Flammability | class | Meets V0 | UL-94 |
| NASA Outgassing, 125ºC, ≤10-6 torr | % | NASA SP-R-0022A | |
| Total Mass Loss | % | 0.01 | NASA SP-R-0022A |
| Collected Volatiles | % | 0.00 | NASA SP-R-0022A |
| Water Vapor Recovered | % | 0.00 | NASA SP-R-0022A |
3. Mechanical Properties:
AD1000 not only possesses exceptional electrical and thermal properties but also showcases impressive mechanical strength. It exhibits a peel strength to copper exceeding 12 lb/in, even after thermal stress. At elevated temperatures of 150ºC, the peel strength remains high at 13.6 lb/in.
With a Young's modulus of 200 kpsi, AD1000 is stiff and resistant to deformation. It also demonstrates a flexural strength of 9.9/7.5 kpsi (machine/cross directions), ensuring resilience and durability in demanding applications.
AD1000 showcases a tensile strength of 5.1 kpsi (machine direction) and 4.3 kpsi (cross direction), highlighting its ability to withstand tension forces. Additionally, it has a compressive modulus exceeding 425 kpsi, maintaining shape and structural integrity under significant compressive loads.
4. Physical Properties:
AD1000 exhibits excellent physical properties, including a low water absorption rate of only 0.03%, ensuring exceptional moisture resistance. Its density at ambient 23ºC stands at 3.20 g/cm3, providing a lightweight yet robust solution for various electronic applications. The thermal conductivity of AD1000 is 0.81 W/mK, facilitating efficient heat dissipation and enhancing overall device performance.
AD1000 meets stringent flammability standards, achieving a V0 rating in the UL-94 classification. Furthermore, it excels in NASA outgassing tests, with minimal total mass loss, collected volatiles, and water vapor recovered at 125ºC and ≤10-6 torr.
Our PCB Capability (AD1000):
| PCB Material: | Woven Glass Reinforced PTFE/Ceramic Filled |
| Designation: | AD1000 |
| Dielectric constant: | 10.2 |
| Dissipation Factor | 0.0023 10GHz |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Dielectric thickness: | 6mil (0.1524mm), 10.5mil (0.2667mm), 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.27mm), 59mil (1.499mm ), 125mil ( 3.175mm ), 127mil (3.226mm ) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, OSP,Bare copper, Pure gold, ENEPIG etc.. |
Conclusion:
AD1000 is a remarkable substrate that offers unparalleled electrical, thermal, mechanical, and physical properties. Its unique woven-glass reinforced PTFE material provides exceptional dimensional stability and mechanical robustness, making it an ideal choice for demanding applications in power amplifiers, filters, couplers, and more.
With our expertise and advanced capabilities, we can deliver reliable and high-performance PCB solutions tailored to your specific needs.