Bicheng Electronics Technology Co., Ltd
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Introducing our newly shipped RF PCB built on the renowned RT/duroid 5880 substrate. Intended for high-frequency applications, this PCB delivers exceptional performance and reliability. Let's explore its outstanding features and benefits in detail:
The RT/duroid 5880 substrate is a high-frequency laminate composed of PTFE composites reinforced with glass microfibers. This combination ensures a low dielectric constant (Dk) and minimal dielectric loss, making it an ideal choice for RF applications. The randomly oriented microfibers within the PTFE composites guarantee uniform Dk, ensuring consistent electrical properties across the board. This uniformity is critical for maintaining signal integrity and minimizing signal loss in high-frequency circuits.
The key features of the RT/duroid 5880 substrate are truly remarkable. It boasts an impressive dielectric constant of 2.2 with a tight tolerance of 0.02 at 10 GHz/23°C. This low Dk value enables efficient signal propagation and minimizes the risk of signal distortion. Additionally, the PCB exhibits an extremely low dissipation factor of 0.0009 at 10 GHz, which translates to minimal energy loss during signal transmission. This characteristic is crucial for high-frequency applications where signal fidelity is of utmost importance.
Another notable feature of the RT/duroid 5880 substrate is its excellent temperature stability. It has a temperature coefficient of dielectric constant (TCDk) of -125 ppm/°C, ensuring consistent performance across a wide temperature range. This stability is essential for applications that are subject to temperature variations, as it guarantees reliable signal transmission regardless of environmental conditions.
Moisture absorption can significantly impact the electrical properties of a PCB. However, the RT/duroid 5880 substrate RF PCB excels in this area as well. It has a negligible moisture absorption rate of 0.02%, making it highly resistant to moisture-related performance degradation. This characteristic is particularly advantageous in high-humidity environments, ensuring consistent and reliable performance over time.
The coefficient of thermal expansion (CTE) values of the RT/duroid 5880 substrate RF PCB are 31 ppm/°C (X-axis), 48 ppm/°C (Y-axis), and 237 ppm/°C (Z-axis). These CTE values contribute to the stability and reliability of the PCB, reducing the risk of mechanical stress or failure during temperature cycling. The isotropic design of the substrate further enhances its performance, allowing for consistent electrical properties in all directions.
| RT/duroid 5880 Typical Value | ||||||
| Property | RT/duroid 5880 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 2.20 2.20±0.02 spec. | Z | N/A | C24/23/50 C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 | |
| Dielectric Constant,εDesign | 2.2 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0004 0.0009 | Z | N/A | C24/23/50 C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 | |
| Thermal Coefficient of ε | -125 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 | |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 | |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 | |
| Specific Heat | 0.96(0.23) | N/A | j/g/k (cal/g/c) | N/A | Calculated | |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1070(156) | 450(65) | X | ||||
| 860(125) | 380(55) | Y | ||||
| Ultimate Stress | 29(4.2) | 20(2.9) | X | |||
| 27(3.9) | 18(2.6) | Y | ||||
| Ultimate Strain | 6 | 7.2 | X | % | ||
| 4.9 | 5.8 | Y | ||||
| Compressive Modulus | 710(103) | 500(73) | X | MPa(kpsi) | A | ASTM D 695 |
| 710(103) | 500(73) | Y | ||||
| 940(136) | 670(97) | Z | ||||
| Ultimate Stress | 27(3.9) | 22(3.2) | X | |||
| 29(5.3) | 21(3.1) | Y | ||||
| 52(7.5) | 43(6.3) | Z | ||||
| Ultimate Strain | 8.5 | 8.4 | X | % | ||
| 7.7 | 7.8 | Y | ||||
| 12.5 | 17.6 | Z | ||||
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 | |
| Thermal Conductivity | 0.2 | Z | W/m/k | 80℃ | ASTM C 518 | |
| Coefficient of Thermal Expansion | 31 48 237 | X Y Z | ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 | |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 | |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 | |
| Copper Peel | 31.2(5.5) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil after solder float | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 | |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A | |
The benefits of the RT/duroid 5880 substrate are extensive. Its uniform electrical properties over a broad frequency range ensure reliable signal integrity, making it suitable for demanding RF applications. The PCB is also easy to cut, shape, and machine according to specific design requirements, enabling efficient manufacturing processes. It is highly resistant to solvents and etching/plating reagents, ensuring durability during fabrication. Moreover, the RT/duroid 5880 substrate RF PCB is well-suited for high-moisture environments, making it an excellent choice for various RF applications that operate in such conditions. With a proven track record and widespread adoption in the industry, this PCB offers a reliable and trusted solution for high-frequency designs. Additionally, it boasts the lowest electrical loss among reinforced PTFE materials, maximizing signal efficiency and transmission quality.
The construction of this RF PCB features a 2-layer rigid design with copper layers of 35 μm on each side. The RT/duroid 5880 substrate with a thickness of 1.575 mm (62mil), providing excellent RF performance while maintaining stability and durability. The finished board thickness is 1.6mm, ensuring reliable mechanical strength and compatibility with standard electronic assemblies.
With its outstanding characteristics, this PCB is suitable for a wide range of high-frequency applications. It is particularly well-suited for commercial airline broadband antennas, where reliable and efficient signal transmission is crucial for maintaining seamless connectivity. Additionally, it excels in microstrip and stripline circuits, millimeter wave systems, radar systems, guidance systems, and point-to-point digital radio antennas.
At our company, we prioritize quality and reliability. The PCB built on RT/duroid 5880 substrate adheres to the highest industry standards, ensuring consistent performance and compatibility with various electronic systems. With its global availability, engineers and designers worldwide can benefit from this exceptional RF solution.
Upgrade your RF designs today and unlock the true potential of your applications with the RT/duroid 5880 RF PCB. Experience unparalleled RF performance and reliability by choosing our cutting-edge solution. Contact us now to explore the endless possibilities of high-frequency technology.