Bicheng Electronics Technology Co., Ltd
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We're delighted to introduce our newly shipped PCB.It's Based on TLX-0 High-Performance substrate,which is a state-of-the-art circuit material designed to meet the demanding requirements of RF and microwave applications. With its exceptional properties and robust construction, this PCB offers unparalleled performance and reliability. Let's explore the features, benefits, and applications that make the TLX-0 stand out from the rest.
1. TLX-0 Introduction:
The TLX-0 is part of the TLX series laminates, which are manufactured using PTFE fiberglass composites. This versatile material boasts a dielectric constant (DK) range of 2.45 - 2.65, making it suitable for a wide range of RF applications. The TLX-0 material is specifically designed for low layer count microwave designs and excels in harsh environments where mechanical reinforcement is crucial.
2. Features:
- Dielectric Constant (DK): The TLX-0 offers a precise DK value of 2.45 +/- 0.04 at 10GHz, ensuring consistent electrical performance.
- Dissipation Factor (DF): With a low DF of 0.0021 at 10GHz, this PCB minimizes signal loss and distortion, enabling reliable high-frequency transmission.
- Low Moisture Absorption: The TLX-0 material exhibits a low moisture absorption rate of 0.02%, enhancing the PCB's durability and preventing degradation caused by moisture exposure.
- Coefficient of Thermal Expansion (CTE): The TLX-0 PCB features a CTE of 21 ppm/°C (X-axis), 23 ppm/°C (Y-axis), and 215 ppm/°C (Z-axis), providing excellent dimensional stability across a wide temperature range.
- Peel Strength: The PCB boasts a peel strength of 12 lbs/in, ensuring secure adhesion between the layers.
| Property | Test Method | Unit | Value | Unit |
| DK @10 GHz | IPC-650 2.5.5.3 | 2.55 | ||
| Df @1.9 GHz | IPC-650 2.5.5.5.1 | 0.0012 | ||
| Df @10 GHz | IPC-650 2.5.5.5.1 | 0.0017 | ||
| Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % |
| Flexural Strength(MD) | ASTM D 709 | psi | 28,900 | N/mm2 |
| Flexural Strength(CD) | ASTM D 709 | psi | 20,600 | N/mm2 |
| Tensile Strength(MD) | ASTM D 902 | psi | 35,600 | N/mm2 |
| Tensile Strength(CD) | ASTM D 902 | psi | 27,500 | N/mm2 |
| Elongation at Break(MD) | ASTM D 902 | % | 3.94 | % |
| Elongation at Break(CD) | ASTM D 902 | % | 3.92 | % |
| Young's Modulus(MD) | ASTM D 902 | kpsi | 980 | N/mm2 |
| Young's Modulus(CD) | ASTM D 902 | kpsi | 1,200 | N/mm2 |
| Young's Modulus(MD) | ASTM D 3039 | kpsi | 1,630 | N/mm2 |
| Poisson's Ratio | ASTM D 3039 | 0.135 | N/mm | |
| Peel Stength(1 oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 15 | N/mm |
| Peel Stength(1 oz.RTF) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 17 | N/mm |
| Peel Stength(½ oz.ed) | IPC-650 2.4.8.3(Elevated Temp.) | Ibs./linear inch | 14 | N/mm |
| Peel Stength(½ oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 11 | N/mm |
| Peel Stength(1 oz.rolled) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 13 | N/mm |
| Thermal Conductivity | ASTM F433/ASTM 1530-06 | W/M*K | 0.19 | W/M*K |
| Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(After Bake.) | mils/in. | 0.06 | mm/M |
| Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.4(After Bake.) | mils/in. | 0.08 | mm/M |
| Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.09 | mm/M |
| Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.1 | mm/M |
| Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm | 6.605 x 108 | Mohm |
| Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm | 3.550 x 106 | Mohm |
| Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm/cm | 1.110 x 1010 | Mohm/cm |
| Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm/cm | 1.046 x 1010 | Mohm/cm |
| CTE(X axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 21 | ppm/℃ |
| CTE(Y axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 23 | ppm/℃ |
| CTE(Z axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 215 | ppm/℃ |
| Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.25 | g/cm3 |
| Td(2% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 535 | ℃ |
| Td(5% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 553 | ℃ |
| Flammability Rating | UL-94 | V-0 |
3. Benefits:
- Excellent PIM Values: The TLX-0 PCB delivers exceptional Passive Intermodulation (PIM) values, measuring lower than -160 dBc. This ensures minimal interference and superior signal integrity in RF applications.
- Mechanical and Thermal Properties: With its fiberglass reinforcement, the TLX-0 offers excellent mechanical strength and thermal stability, making it suitable for extreme environments.
- Low and Stable DK: The tightly controlled dielectric constant ensures precise electrical characteristics and consistent signal performance.
- Dimensional Stability: The TLX-0 PCB maintains its shape and size even under challenging conditions, ensuring reliable operation in various applications.
- Low Moisture Absorption: The low moisture absorption rate enhances the PCB's resistance to moisture-related issues, such as delamination and electrical degradation.
- Tightly Controlled DK: The TLX-0 material ensures tight tolerance of ± 0.04 for the dielectric constant, guaranteeing predictable and accurate circuit performance.
- Low DF: The low dissipation factor minimizes signal loss and distortion, enabling high-quality signal transmission.
- UL 94 V0 Rating: The TLX-0 PCB meets the UL 94 V0 standard for flame retardancy, ensuring safety and compliance.
- For Low Layer Count Microwave Designs: The TLX-0 material is specifically designed for low layer count microwave PCB designs, offering flexibility and cost-effectiveness.
4. PCB Stackup:
This PCB is a 2-layer rigid board with a copper layer of 35 μm on both sides. The TLX-0 core has a thickness of 0.254 mm (10 mils), providing a compact and efficient design.
5. PCB Construction Details:
This RF PCB comes in a size of 80mm x 40.8mm with a tolerance of +/- 0.15mm. It supports a minimum trace/space of 6/7 mils and a minimum hole size of 0.3mm. The finished board thickness is 0.32mm, and the finished copper weight is 1oz (1.4 mils) on the outer layers. This PCB features a via plating thickness of 20 μm and is finished with immersion gold for optimal performance. The PCB does not have top or bottom silkscreen or solder mask. Each PCB undergoes a rigorous 100% electrical test before shipment, ensuring uncompromised functionality.
6. PCB Statistics:
This PCB supports up to 15 components and features a total of 38 pads, including 26 thru-hole pads and 12 top surface mount technology (SMT) pads. There are no bottom SMT pads. It also includes 27 vias, facilitating efficient electrical connections, and supports 3 nets, allowing for versatile circuit configurations.
7. Type of Artwork Supplied: The PCB is compatible with Gerber RS-274-X, a widely used standard for PCB artwork.
8. Quality Standard: This PCB adheres to the IPC-Class-2 standard, ensuring high-quality manufacturing and assembly.
9. Availability: The TLX-0 High-Performance PCB is available worldwide, making it accessible to customers across the globe.
10. Typical Applications:
The TLX-0 PCB is ideally suited for a wide range of RF and microwave applications. Some typical applications include:
- Couplers, splitters, combiners, amplifiers, antennas, and passive components.
- Radar systems and mobile communications.
- Microwave test equipment.
- Microwave transmission devices and RF components.
With its exceptional performance, reliability, and versatility, the TLX-0 High-Performance PCB empowers engineers and designers to create cutting-edge RF and microwave systems. Whether you're working on space launch applications, engine modules, or warship antennas, the TLX-0 PCB delivers outstanding mechanical, thermal, and electrical properties to meet your most demanding requirements.