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Bicheng Electronics Technology Co., Ltd

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Home / Products / RF PCB Board / RO3003G2 High Frequency PCB Built On 10mil 0.254mm Substrates With Immersion Gold /

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RO3003G2 High Frequency PCB Built On 10mil 0.254mm Substrates With Immersion Gold
RO3003G2 High Frequency PCB Built On 10mil 0.254mm Substrates With Immersion Gold
  • RO3003G2 High Frequency PCB Built On 10mil 0.254mm Substrates With Immersion Gold
  • RO3003G2 High Frequency PCB Built On 10mil 0.254mm Substrates With Immersion Gold
Products Detailed
Brief Introduction This PCB is a 2-layer rigid PCB with a stackup consisting of a 10 mil (0.254mm) thick RO3003G2 dielectric material and features a ...
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Product Tags:
insb wafer electronik pcb danam electronics pcb

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