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Introducing our newly shipped PCB, a high-quality product that combines the exceptional performance of RO4003C and FR-4 (IT-180A) materials. This 6-layer rigid PCB is designed to meet the stringent requirements of various applications, providing reliable and efficient performance. Let's delve into the details of this advanced PCB:
1. RO4003C Profile:
The PCB utilizes the Rogers RO4003C Hydrocarbon Ceramic woven glass material. With a Dielectric Constant (Dk) of 3.38 at 10 GHz and a Dissipation Factor of 0.0027 at 10 GHz, it ensures reliable signal integrity in high-frequency applications. The RO4003C material has a Tg (Glass Transition Temperature) greater than 280 °C and a Td (Thermal Decomposition Temperature) greater than 425°C, ensuring excellent thermal stability.
1.2 FR-4 (IT-180A) Profile:
This hybrid PCB also incorporates the IT-180A FR-4 material by ITEQ. This high-Tg (175℃ by DSC) material offers low CTE (Coefficient of Thermal Expansion) and high thermal reliability. With a Dielectric Constant (Dk) of 4.4 at 1 GHz and a Dissipation Factor of 0.015 at 1 GHz, it provides reliable electrical performance. The IT-180A material has a Tg greater than 175 °C, ensuring stability under high-temperature conditions. It also exhibits excellent CAF (Conductive Anodic Filament) resistance, lead-free compatibility, and exceptional mechanical processability.
2. Features and Attentions:
The RO4003C laminates offer tight control on dielectric constant (Dk) and low loss, providing excellent signal integrity. They are cost-effective compared to conventional microwave laminates and utilize the same processing method as standard epoxy/glass laminates. However, it's important to note that RO4003C materials are non-brominated and are not UL 94 V-0 rated. The IT-180A material, on the other hand, offers exceptional CAF resistance, lead-free compatibility, and through-hole reliability. It also exhibits high heat resistance and excellent mechanical processability.
| RO4003C Typical Value | |||||
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.55 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0027 0.0021 | Z | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 x 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850) 19,450(2,821) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2) 100(14.5) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276 (40) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m (mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11 14 46 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.71 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
| Density | 1.79 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 1.05 (6.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
3. Stackup:
This 6-layer rigid PCB features a well-designed stackup for optimal performance. The copper layers are 35 μm (1oz) thick on both sides. The PCB consists of two Rogers 4003C cores, each with a thickness of 12mil (0.305mm), and a core IT-180A FR-4 layer. Prepreg layers with a thickness of 0.1mm are used for insulation between copper layers.
4. Construction Details:
The board dimensions of this PCB are 57mm x 57mm, providing a compact and efficient form factor. The minimum trace/space is 4/5 mils, allowing for precise routing of high-density circuits. The minimum hole size is 0.3mm, and all vias are filled and capped for enhanced reliability. The finished board thickness is 1.1mm, with a finished copper weight of 1oz (1.4 mils) on each layer. The via plating thickness is 25 μm, ensuring strong and reliable electrical connections. The surface finish is Immersion Gold (ENIG), providing excellent solderability and corrosion resistance. The PCB features white top and bottom silkscreens, as well as a Matt Blue top and bottom solder mask. The top traces are designed to have a 7 mil width, with a single-end impedance controlled at 90 ohms. Each PCB undergoes a 100% electrical test prior to shipment to ensure quality and reliability.
5. PCB Statistics:
This PCB includes a total of 28 components and 68 pads. It comprises 32 thru-hole pads, 21 top SMT pads, and 15 bottom SMT pads. There are 73 vias and 6 nets, enabling efficient electrical connections.
6. Artwork and Quality Standard:
The artwork supplied for this circuit baord is in Gerber RS-274-X format, ensuring compatibility with standard PCB manufacturing processes. The PCB adheres to the IPC-Class-2 quality standard, guaranteeing high-quality manufacturing and reliability.
7. Availability:
This hybrid PCB is available worldwide, ensuring engineers and designers from various regions can access this high-performance and reliable product.
8. Typical Applications:
This PCB is suitable for a wide range of applications due to its excellent performance characteristics. Some typical applications include Cellular Base Station Antennas and Power Amplifiers, RF Identification Tags, Automotive Radar and Sensors, and LNB's (Low Noise Block) for Direct Broadcast Satellites. Its reliable signal transmission, thermal stability, and mechanical processability make it an ideal choice for demanding electronic systems.
In summary, our newly shipped PCB combines the advantages of RO4003C and FR-4 (IT-180A) materials to deliver exceptional performance, reliability, and thermal stability. With its advanced features, precise construction, and adherenceto industry standards, this PCB is well-suited for a variety of applications. Whether you're working on cellular base stations, RF identification systems, automotive radar, or satellite receivers, this PCB provides the reliability and efficiency you need. Order now and experience the high-performance capabilities of our RO4003C and FR-4 (IT-180A) PCB. Available worldwide, it's the perfect choice for your advanced electronic projects.