Bicheng Electronics Technology Co., Ltd

We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified

Manufacturer from China
Verified Supplier
5 Years
Home / Products / RF PCB Board /

Immersion Gold PCB based on 20mil RO3003 Laminates 2 Layer Circuit Boards

Contact Now
Bicheng Electronics Technology Co., Ltd
Visit Website
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MsIvy Deng
Contact Now

Immersion Gold PCB based on 20mil RO3003 Laminates 2 Layer Circuit Boards

Ask Latest Price
Video Channel
Brand Name :Bicheng
Certification :UL, ISO9001, IATF16949
Place of Origin :CHINA
MOQ :1PCS
Price :USD9.99-99.99
Payment Terms :T/T
Supply Ability :5000PCS per month
Delivery Time :8-9 working days
Packaging Details :Vacuum bags+Cartons
Contact Now

Add to Cart

View Product Description

Introducing our newly shipped PCB based on 20mil RO3003 materials, a high-quality solution designed specifically for commercial microwave and RF applications. This advanced PCB offers exceptional stability of dielectric constant (Dk) over a wide range of temperatures and frequencies, making it ideal for various cutting-edge technologies such as automotive radar, advanced driver assistance systems (ADAS), and 5G wireless infrastructure.

Key Features:
1. Rogers RO3003 Ceramic-Filled PTFE Composites: This PCB utilizes high-quality RO3003 laminates known for their excellent stability and low dielectric loss. These ceramic-filled PTFE composites provide reliable performance up to 77 GHz, making them suitable for high-frequency applications.

2. Impressive Electrical Properties: The RO3003 material boasts a dielectric constant of 3+/- 0.04 at 10 GHz/23°C, ensuring reliable signal transmission. It also exhibits a low dissipation factor of 0.001 at 10 GHz/23°C, minimizing signal loss. These properties make it well-suited for applications requiring precise and accurate signal integrity.

3. Thermal Stability and Mechanical Reliability: With a thermal decomposition temperature (Td) exceeding 500°C, the substrate can withstand high-temperature environments. The low coefficient of thermal expansion (CTE) in the range of -55 to 288°C (X axis: 17 ppm/°C, Y axis: 16 ppm/°C, Z axis: 25 ppm/°C) ensures excellent dimensional stability and reliability. It also provides uniform mechanical properties across a range of dielectric constants, making it ideal for multi-layer board designs with varying requirements.

Property RO3003 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.04 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.001 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -3 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.06
0.07
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107 MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107 COND A IPC 2.5.17.1
Tensile Modulus 930
823
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.04 % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.9 j/g/k Calculated
Thermal Conductivity 0.5 W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
16
25
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500 ℃ TGA ASTM D 3850
Density 2.1 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 12.7 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes

4. PCB Construction Details: This 2-layer rigid PCB features a stackup with two copper layers, each 35 μm thick. The RO3003 substrate has a thickness of 20mil (0.508mm), providing a sturdy foundation for the circuitry. The finished board thickness is 0.6mm, with a finished copper weight of 1 oz (1.4 mils) on the outer layers. The via plating thickness is 20 μm, ensuring robust electrical connections. The surface finish is Immersion Gold, offering excellent solderability and corrosion resistance.

5. PCB Statistics: This PCB includes 27 components and a total of 61 pads, with 40 thru-hole pads and 21 top surface mount technology (SMT) pads. It features 42 vias and 4 nets, enabling efficient electrical connectivity. The board dimensions are 85.7mm x 73.2mm, providing a compact and efficient form factor.

Immersion Gold PCB based on 20mil RO3003 Laminates 2 Layer Circuit Boards

6. Manufacturing Standards and Availability: The PCB adheres to the IPC-Class-2 quality standard, ensuring high-quality manufacturing and reliability. It is available worldwide, allowing engineers and designers from various regions to access this advanced product.

7. Typical Applications: This PCB based on RO3003 materials is well-suited for a range of applications requiring high-frequency performance, thermal stability, and mechanical reliability. Some typical applications include automotive radar systems, global positioning satellite antennas, cellular telecommunications systems (power amplifiers and antennas), wireless communication patch antennas, direct broadcast satellites, datalink on cable systems, remote meter readers, and power backplanes.

In summary, our newly shipped PCB based on 20mil RO3003 materials delivers exceptional performance, stability, and reliability for commercial microwave and RF applications. With its advanced features, precise construction, and adherence to industry standards, this PCB is an excellent choice for demanding electronic systems. Whether you're working on automotive radar, satellite communications, or wireless technologies, this PCB provides the high-performance capabilities you need. Contact us if you have any question.

Inquiry Cart 0
You May Like
TLY-3 lightweight 100x90mm Communication PCB 2 Sided Taconic TLY Laminates
TLY-3 lightweight 100x90mm Communication PCB 2 Sided Taconic TLY Laminates
Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board DK3.0 DF 0.001 Microwave PCB
Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board DK3.0 DF 0.001 Microwave PCB
RO3035 20mil 0.508mm DK3.5 RF PCB Board For Direct Broadcast Satellites
RO3035 20mil 0.508mm DK3.5 RF PCB Board For Direct Broadcast Satellites
1.6mm TLF-35 RF PCB Board Ultra Low Moisture Absorption Rate
1.6mm TLF-35 RF PCB Board Ultra Low Moisture Absorption Rate
TLY-5 7.5mil 0.191mm Double Sided Printed Circuit Boards With DK2.2
TLY-5 7.5mil 0.191mm Double Sided Printed Circuit Boards With DK2.2
RF-35TC 0.8mm RF PCB Board
RF-35TC 0.8mm RF PCB Board
RO3010 25mil 0.635mm Microwave PCB Board LPSM Solder Mask
RO3010 25mil 0.635mm Microwave PCB Board LPSM Solder Mask
Rogers 3035 60mil 1.524mm RF PCB Board For Remote Meter Readers
Rogers 3035 60mil 1.524mm RF PCB Board For Remote Meter Readers
Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB
Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB
20mil Double Sided 1oz RF PCB Board With RT/Duroid 5870 Base Material
20mil Double Sided 1oz RF PCB Board With RT/Duroid 5870 Base Material
60mil AD250C Double Sided Rigid Circuit Board With Hot Air Soldering Level
60mil AD250C Double Sided Rigid Circuit Board With Hot Air Soldering Level
30mil Dual Layer RF PCB Based On AD300D Substrate With Immersion Silver
30mil Dual Layer RF PCB Based On AD300D Substrate With Immersion Silver
2 Layer RF PCB Based On 30mil AD350A Substrate With Immersion Silver
2 Layer RF PCB Based On 30mil AD350A Substrate With Immersion Silver
Double Sided PCB 25mil CER-10 Substrates With Black Silkscreen And Immersion Gold
Double Sided PCB 25mil CER-10 Substrates With Black Silkscreen And Immersion Gold
20mil Rogers CLTE-XT PCB 2 Layer Rigid Circuit Boards With Immersion Silver
20mil Rogers CLTE-XT PCB 2 Layer Rigid Circuit Boards With Immersion Silver
Send your message to this supplier
*From:
*To:

Bicheng Electronics Technology Co., Ltd

*Subject:
*Message:
Characters Remaining : (0/3000)
Contact Now