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Introducing our newly shipped PCB based on 20mil RO3003 materials, a high-quality solution designed specifically for commercial microwave and RF applications. This advanced PCB offers exceptional stability of dielectric constant (Dk) over a wide range of temperatures and frequencies, making it ideal for various cutting-edge technologies such as automotive radar, advanced driver assistance systems (ADAS), and 5G wireless infrastructure.
Key Features:
1. Rogers RO3003 Ceramic-Filled PTFE Composites: This PCB utilizes high-quality RO3003 laminates known for their excellent stability and low dielectric loss. These ceramic-filled PTFE composites provide reliable performance up to 77 GHz, making them suitable for high-frequency applications.
2. Impressive Electrical Properties: The RO3003 material boasts a dielectric constant of 3+/- 0.04 at 10 GHz/23°C, ensuring reliable signal transmission. It also exhibits a low dissipation factor of 0.001 at 10 GHz/23°C, minimizing signal loss. These properties make it well-suited for applications requiring precise and accurate signal integrity.
3. Thermal Stability and Mechanical Reliability: With a thermal decomposition temperature (Td) exceeding 500°C, the substrate can withstand high-temperature environments. The low coefficient of thermal expansion (CTE) in the range of -55 to 288°C (X axis: 17 ppm/°C, Y axis: 16 ppm/°C, Z axis: 25 ppm/°C) ensures excellent dimensional stability and reliability. It also provides uniform mechanical properties across a range of dielectric constants, making it ideal for multi-layer board designs with varying requirements.
| Property | RO3003 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.0±0.04 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.001 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -3 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.06 0.07 | X Y | mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 107 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 107 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 930 823 | X Y | MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.04 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
| Specific Heat | 0.9 | j/g/k | Calculated | ||
| Thermal Conductivity | 0.5 | W/M/K | 50℃ | ASTM D 5470 | |
| Coefficient of Thermal Expansion (-55 to 288℃) | 17 16 25 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ℃ TGA | ASTM D 3850 | ||
| Density | 2.1 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 12.7 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes |
4. PCB Construction Details: This 2-layer rigid PCB features a stackup with two copper layers, each 35 μm thick. The RO3003 substrate has a thickness of 20mil (0.508mm), providing a sturdy foundation for the circuitry. The finished board thickness is 0.6mm, with a finished copper weight of 1 oz (1.4 mils) on the outer layers. The via plating thickness is 20 μm, ensuring robust electrical connections. The surface finish is Immersion Gold, offering excellent solderability and corrosion resistance.
5. PCB Statistics: This PCB includes 27 components and a total of 61 pads, with 40 thru-hole pads and 21 top surface mount technology (SMT) pads. It features 42 vias and 4 nets, enabling efficient electrical connectivity. The board dimensions are 85.7mm x 73.2mm, providing a compact and efficient form factor.
6. Manufacturing Standards and Availability: The PCB adheres to the IPC-Class-2 quality standard, ensuring high-quality manufacturing and reliability. It is available worldwide, allowing engineers and designers from various regions to access this advanced product.
7. Typical Applications: This PCB based on RO3003 materials is well-suited for a range of applications requiring high-frequency performance, thermal stability, and mechanical reliability. Some typical applications include automotive radar systems, global positioning satellite antennas, cellular telecommunications systems (power amplifiers and antennas), wireless communication patch antennas, direct broadcast satellites, datalink on cable systems, remote meter readers, and power backplanes.
In summary, our newly shipped PCB based on 20mil RO3003 materials delivers exceptional performance, stability, and reliability for commercial microwave and RF applications. With its advanced features, precise construction, and adherence to industry standards, this PCB is an excellent choice for demanding electronic systems. Whether you're working on automotive radar, satellite communications, or wireless technologies, this PCB provides the high-performance capabilities you need. Contact us if you have any question.