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The Rogers RO4350B PCB is a cutting-edge solution that combines exceptional electrical performance with cost-effective manufacturing, making it an ideal choice for a wide range of high-frequency and high-performance applications.
At the heart of this PCB is the proprietary Rogers RO4350B material, a woven glass reinforced hydrocarbon/ceramic composite that delivers performance on par with PTFE/woven glass while offering the ease of processing associated with standard epoxy/glass. This unique material composition allows the RO4350B PCB to achieve a consistent dielectric constant (Dk) of 3.48 ± 0.05 at 10GHz/23°C and a low dissipation factor of 0.0037 at the same frequency and temperature.
One of the key advantages of the RO4350B material is its exceptional dimensional stability. The coefficient of thermal expansion (CTE) is 10 ppm/°C in the X-axis, 12 ppm/°C in the Y-axis, and 32 ppm/°C in the Z-axis, closely matching the expansion characteristics of copper. This allows the RO4350B PCB to maintain excellent dimensional stability, a critical property for the construction of mixed dielectric multi-layer boards. Additionally, the low Z-axis CTE of the RO4350B laminates ensures reliable plated through-hole quality, even in severe thermal shock applications.
| RO4350B Typical Value | |||||
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0037 0.0031 | Z | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432) 14,153(2,053) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5) 130(18.9) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255 (37) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10 12 32 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
| Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 0.88 (5.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
| Flammability | (3)V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Another notable feature of the RO4350B material is its high glass transition temperature (Tg) of over 280°C (536°F). This ensures that the expansion characteristics of the PCB remain stable across a wide range of processing temperatures, making it suitable for a variety of manufacturing processes. Furthermore, the material's low water absorption of 0.06% contributes to its overall reliability and performance.
This Rogers RO4350B PCB is constructed with a 2-layer rigid design, featuring 35μm of copper on both the top and bottom layers, and a 0.102mm (4mil) Rogers RO4350B core. The board dimensions are 43.98mm x 33.22mm, with a tight tolerance of ±0.15mm. The PCB features a minimum trace/space of 4/5 mils and a minimum hole size of 0.3mm, ensuring high-quality and reliable performance.
One of the key benefits of the RO4350B PCB is its cost-effectiveness. Unlike traditional PTFE-based materials, the RO4350B can be processed using standard epoxy/glass techniques, allowing for a more economical fabrication process. This makes the RO4350B PCB an attractive option for designers and engineers who require high-performance circuit boards without the associated premium price tag.
The versatility of the Rogers RO4350B PCB is evident in its wide range of applications, including cellular base station antennas and power amplifiers, RF identification tags, automotive radar and sensors, and LNBs for direct broadcast satellites. Its exceptional electrical and mechanical properties, combined with its cost-effective manufacturing, make the RO4350B PCB an excellent choice for engineers and designers seeking a reliable, high-quality circuit board solution.
In summary, the Rogers RO4350B PCB represents a remarkable blend of performance and affordability, offering designers and engineers a cutting-edge solution that meets the demands of today's high-frequency and high-performance applications.