Bicheng Electronics Technology Co., Ltd

We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified

Manufacturer from China
Verified Supplier
6 Years
Home / Products / RF PCB Board /

Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards

Contact Now
Bicheng Electronics Technology Co., Ltd
Visit Website
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MsIvy Deng
Contact Now

Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards

Ask Latest Price
Brand Name :Bicheng
Certification :UL, ISO9001, IATF16949
Place of Origin :CHINA
MOQ :1PCS
Price :USD9.99-99.99/PCS
Payment Terms :T/T
Supply Ability :5000PCS per month
Delivery Time :8-9 working days
Packaging Details :Vacuum bags+Cartons
Material :RO3006
PCB thickness :25mil
PCB size :51.31 mm x 111.92 mm
Layer count :2-layer
Copper weight :1OZ
Surface finish :Immersion Gold
Silkscreen :White
more
Contact Now

Add to Cart

Find Similar Videos
View Product Description

Rogers RO3006 PCB 25mmil 2-Layer Immersion Gold Circuit Boards

Introducing our high-performance Rogers RO3006 PCB, designed with advanced ceramic-filled PTFE composite materials that ensure exceptional electrical and mechanical stability. With its consistent dielectric properties, this PCB is engineered to excel in demanding applications across various industries.

Key Features
- Material: Rogers RO3006 ceramic-filled PTFE composites
- Dielectric Constant: 6.15 ± 0.15 at 10 GHz, 23°C
- Dissipation Factor: 0.002 at 10 GHz, 23°C
- Thermal Properties: Td > 500°C, Thermal Conductivity of 0.79 W/mK
- Moisture Absorption: 0.02%
- Coefficient of Thermal Expansion: X/Y axes: 17 ppm/°C, Z axis: 24 ppm/°C (-55 to 288 °C)

Property RO3006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.05 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 6.5 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.002 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -262 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.27
0.15
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105 MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105 COND A IPC 2.5.17.1
Tensile Modulus 1498
1293
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.02 % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.86 j/g/k Calculated
Thermal Conductivity 0.79 W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
17
24
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500 ℃ TGA ASTM D 3850
Density 2.6 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 7.1 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes

Benefits
- Uniform Mechanical Properties: Ideal for multi-layer board designs, especially where a range of dielectric constants is required.

- Low In-Plane Expansion Coefficient: Matches copper expansion, ensuring reliable surface-mounted assemblies, making it perfect for temperature-sensitive applications.

- Cost-Effective Manufacturing: Our volume manufacturing process allows for economical laminate pricing without compromising quality.

PCB Specifications

- Construction:

- Copper Layer 1: 35 μm
- Rogers RO3006 Substrate: 25 mil (0.635 mm)
- Copper Layer 2: 35 μm

The Rogers RO3006 PCB measures 51.31 mm x 111.92 mm and consists of two pieces, making it versatile for various applications. Manufacturing specifications include a minimum trace/space of 5/4 mils and a minimum hole size of 0.4 mm. The finished board thickness is 0.76 mm, with a finished copper weight of 1 oz (1.4 mils) on the outer layers. The via plating thickness is 20 μm, and the surface finish is immersion gold for enhanced durability.

The top silkscreen is white, while the bottom silkscreen is not present. The top solder mask is green, improving trace visibility. To ensure reliability, each PCB undergoes 100% electrical testing before shipment.

PCB Material: Ceramic-filled PTFE Composites
Designation: RO3006
Dielectric constant: 6.15
Dissipation Factor 0.002 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Laminate thickness: 5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards

Artwork and Standards

- Artwork Provided: Gerber RS-274-X
- Accepted Standard: IPC-Class-2
- Availability: Worldwide

Typical Applications
Our Rogers RO3006 PCB is ideally suited for:

- Automotive radar applications
- Global positioning satellite antennas
- Cellular telecommunications systems (power amplifiers and antennas)
- Patch antennas for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes

Elevate your projects with the reliability and performance of the Rogers RO3006 PCB—engineered for excellence in demanding application.

Inquiry Cart 0