Bicheng Electronics Technology Co., Ltd
We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified
Add to Cart
TLX-8 PCB is a specialized printed circuit board made from high-performance PTFE fiberglass laminates, designed for reliability in a wide variety of RF applications. This versatile material is ideal for low layer count microwave designs, providing mechanical reinforcement in severe environments such as space launches, high-temperature engine modules, and maritime applications.
Key Features
- Excellent PIM Values: Achieving values lower than -160 dBc for enhanced performance.
- Mechanical & Thermal Properties: Exceptional resilience in extreme conditions.
- Low & Stable Dielectric Constant (Dk): Ensures consistent performance.
- Dimensionally Stable: Maintains integrity under varying conditions.
- Low Moisture Absorption: Minimizes the risk of performance degradation.
- UL 94 V0 Rating: Compliant with stringent flammability standards.
Electrical Properties
- Dielectric Constant @ 10 GHz: 2.55 ± 0.04
- Dissipation Factor @ 10 GHz: 0.0018
- Surface Resistivity: 6.605 x 10^8 Mohm (elevated temp), 3.550 x 10^6 Mohm (humidity)
- Volume Resistivity: 1.110 x 10^10 Mohm/cm (elevated temp), 1.046 x 10^10 Mohm/cm (humidity)
| TLX-8 TYPICAL VALUES | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| DK @10 GHz | IPC-650 2.5.5.3 | 2.55 | 2.55 | ||
| Df @1.9 GHz | IPC-650 2.5.5.5.1 | 0.0012 | 0.0012 | ||
| Df @10 GHz | IPC-650 2.5.5.5.1 | 0.0017 | 0.0017 | ||
| Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Flexural Strength(MD) | ASTM D 709 | psi | 28,900 | N/mm2 | |
| Flexural Strength(CD) | ASTM D 709 | psi | 20,600 | N/mm2 | |
| Tensile Strength(MD) | ASTM D 902 | psi | 35,600 | N/mm2 | |
| Tensile Strength(CD) | ASTM D 902 | psi | 27,500 | N/mm2 | |
| Elongation at Break(MD) | ASTM D 902 | % | 3.94 | % | 3.94 |
| Elongation at Break(CD) | ASTM D 902 | % | 3.92 | % | 3.92 |
| Young's Modulus(MD) | ASTM D 902 | kpsi | 980 | N/mm2 | |
| Young's Modulus(CD) | ASTM D 902 | kpsi | 1,200 | N/mm2 | |
| Young's Modulus(MD) | ASTM D 3039 | kpsi | 1,630 | N/mm2 | |
| Poisson's Ratio | ASTM D 3039 | 0.135 | N/mm | ||
| Peel Stength(1 oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 15 | N/mm | |
| Peel Stength(1 oz.RTF) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 17 | N/mm | |
| Peel Stength(½ oz.ed) | IPC-650 2.4.8.3(Elevated Temp.) | Ibs./linear inch | 14 | N/mm | |
| Peel Stength(½ oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 11 | N/mm | |
| Peel Stength(1 oz.rolled) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 13 | N/mm | 2.1 |
| Thermal Conductivity | ASTM F433/ASTM 1530-06 | W/M*K | 0.19 | W/M*K | 0.19 |
| Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(After Bake.) | mils/in. | 0.06 | mm/M | |
| Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.4(After Bake.) | mils/in. | 0.08 | mm/M | |
| Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.09 | mm/M | |
| Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.1 | mm/M | |
| Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm | 6.605 x 108 | Mohm | 6.605 x 108 |
| Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm | 3.550 x 106 | Mohm | 3.550 x 106 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm/cm | 1.110 x 1010 | Mohm/cm | 1.110 x 1010 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm/cm | 1.046 x 1010 | Mohm/cm | 1.046 x 1010 |
| CTE(X axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 21 | ppm/℃ | 21 |
| CTE(Y axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 23 | ppm/℃ | 23 |
| CTE(Z axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 215 | ppm/℃ | 215 |
| Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.25 | g/cm3 | 2.25 |
| Td(2% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 535 | ℃ | |
| Td(5% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 553 | ℃ | |
| Flammability Rating | UL-94 | V-0 | V-0 | ||
The construction of this PCB includes a 2-layer rigid stackup, featuring 35 μm copper layers on both sides and a 1.27 mm (50 mil) Taconic TLX-8 core. The board dimensions are 130 mm x 75 mm (± 0.15 mm), with a finished thickness of 1.3 mm. It supports minimum trace and space requirements of 7/6 mils and a minimum hole size of 0.35 mm. Each board is finished with an immersion gold surface finish and a green top solder mask, with 100% electrical testing conducted prior to shipment to ensure reliability.
It is supplied with artwork in the Gerber RS-274-X format and complies with IPC-Class-2 quality standards. This PCB is available for worldwide, making it accessible to engineers globally.
Typical applications for TLX-8 PCB include radar systems, mobile communications, microwave test equipment, microwave transmission devices, and various coupling, splitting, combining, amplifying, and antenna solutions. With its advanced features and reliable performance, the TLX-8 PCB is an excellent choice for modern RF and microwave applications.