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TP300 PCB is an advanced printed circuit board crafted from the unique TP thermoplastic material, specifically designed for high-frequency applications. The dielectric layer of TP laminates is composed of ceramics and polyphenylene oxide resin (PPO), offering exceptional dielectric performance without the reinforcement of fiberglass. This innovative structure allows for precise adjustment of the dielectric constant, making the TP300 suitable for a wide range of circuit requirements.
Introduction of Wangling TP
The TP material is a distinctive high-frequency thermoplastic used in the industry. Its dielectric layer is composed of ceramics and polyphenylene oxide resin (PPO), eliminating the need for fiberglass reinforcement. The dielectric constant can be finely tuned by adjusting the ratio of ceramics to PPO resin. This specialized production process results in outstanding dielectric performance and exceptional reliability. In this context, "TP" refers to the smooth surface material without copper cladding, while "TP-1" indicates the version with copper cladding on one side, and "TP-2" designates the material with copper cladding on both sides.
Key Features
One of the defining characteristics of the TP300 is its adjustable dielectric constant, which can be selected within a range of 3 to 25. Common options include 3.0, 4.4, 6.0, and 9.6, with stable performance across these values. The dielectric loss is low, with minimal variation up to 10 GHz, ensuring reliable operation in high-frequency applications. The TP300 can withstand long-term operating temperatures ranging from -100°C to +150°C, providing excellent low-temperature resistance. However, care should be taken not to exceed 180°C, as this may lead to deformation and performance degradation.
| Product Technical Parameter | Product Models & Data Sheet | |||||||||||||||
| Product Features | Test Conditions | Unit | TP TP-1 TP-2 | |||||||||||||
| Dielectric Constant | When the dielectric constant is ≤11, the test condition is 10GHz. When the dielectric constant is >11, the test condition is 5GHz. | / | 3.0±0.06 | 4.4±0.09 | 6.0±0.12 | |||||||||||
| 6.15±0.12 | 9.2±0.18 | 9.6±0.19 | ||||||||||||||
| 10.2±0.2 | 11.0±0.022 | 16.0±0.4 | ||||||||||||||
| 20.0±0.8 | 22.0±0.88 | 25.0±1.0 | ||||||||||||||
| The dielectric constant can be customized within the range of 3.0 to 25. | ||||||||||||||||
| Dielectric Constant Tolerance | Dielectric Constant 3.0～11.0 | / | ±2% | |||||||||||||
| Dielectric Constant 11.1～16.0 | / | ±2.5% | ||||||||||||||
| Dielectric Constant 16.1～25.0 | / | ±4% | ||||||||||||||
| Loss Tangent | Loss Tangent 3.0～9.5 | 10GHz | / | 0.0010 | ||||||||||||
| Loss Tangent 9.6～11.0 | 10GHz | / | 0.0012 | |||||||||||||
| Loss Tangent 11.1～16.0 | 5GHz | / | 0.0015 | |||||||||||||
| Loss Tangent 16.1～25.0 | 5GHz | / | 0.0020～0.0025 | |||||||||||||
| Dielectric Constant Temperature Coefficient | Dielectric Constant 3.0～9.5 | -55 º~150ºC | PPM/℃ | -50 | ||||||||||||
| Dielectric Constant 9.6～16.0 | -55 º~150ºC | PPM/℃ | -40 | |||||||||||||
| Dielectric Constant 16.1～25.0 | -55 º~150ºC | PPM/℃ | -55 | |||||||||||||
| Peel Strength | 1 OZ Normal State | N/mm | >0.6 | |||||||||||||
| 1 OZ After AC Humidity Test | N/mm | >0.4 | ||||||||||||||
| Volume Resistivity | Normal State at 500V | MΩ.cm | >1×109 | |||||||||||||
| Surface Resistivity | Normal State at 500V | MΩ | >1×107 | |||||||||||||
| Coefficient of Thermal Expansion (XY Z) | Dielectric Constant 3.00～4.40 | -55 º~150ºC | PPM/℃ | 60,60,70 | ||||||||||||
| Dielectric Constant 4.60～6.15 | -55 º~150ºC | PPM/℃ | 50,50,60 | |||||||||||||
| Dielectric Constant 6.16～11.0 | -55 º~150ºC | PPM/℃ | 40,40,55 | |||||||||||||
| Dielectric Constant 11.1～16.0 | -55 º~150ºC | PPM/℃ | 40,40,50 | |||||||||||||
| Dielectric Constant 16.1～25.0 | -55 º~150ºC | PPM/℃ | 35,35,40 | |||||||||||||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.01 | |||||||||||||
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -100º~150ºC | |||||||||||||
| Material Composition | Polyphenylene oxide, ceramic, paired with ED copper foil. | |||||||||||||||
| The density and thermal conductivity data for materials with different dielectric constants are as follows: | ||||||||||||||||
| Product Features | Unit | Dielectric Constanct | ||||||||||||||
| 3.0 | 4.4 | 6.0 | 6.15 | 9.6 | 10.2 | 11.0 | 16.0 | 20.0 | 22.0 | 25.0 | ||||||
| Density | g/cm3 | 1.69 | 1.89 | 2.1 | 2.12 | 2.26 | 2.33 | 2.40 | 2.76 | 2.73 | 2.77 | 2.94 | ||||
| Thermal Conductivity | W/(M.K) | 0.40 | 0.44 | 0.55 | 0.55 | 0.65 | 0.67 | 0.70 | 0.80 | 0.85 | 0.90 | 1.0 | ||||
| PCB Material: | Polyphenylene oxide, ceramic | ||
| Designation (TP Series) | Designation | DK | DF |
| TP300 | 3.0±0.06 | 0.0010 | |
| TP440 | 4.4±0.09 | 0.0010 | |
| TP600 | 6.0±0.12 | 0.0010 | |
| TP615 | 6.15±0.12 | 0.0010 | |
| TP920 | 9.2±0.18 | 0.0010 | |
| TP960 | 9.6±0.2 | 0.0011 | |
| TP1020 | 10.2±0.2 | 0.0011 | |
| TP1100 | 11.0±0.22 | 0.0011 | |
| TP1600 | 16.0±0.32 | 0.0015 | |
| TP2000 | 20.0±0.4 | 0.0020 | |
| TP2200 | 22.0±0.44 | 0.0022 | |
| TP2500 | 25.0±0.5 | 0.0025 | |
| Layer count: | Single Sided, Double Sided PCB | ||
| Copper weight: | 1oz (35µm), 2oz (70µm) | ||
| Dielectric thickness (Dielectric thickness or overall thickness) | 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 10.0mm, 12.0mm | ||
| PCB size: | ≤150mm X 220mm | ||
| Solder mask: | Green, Black, Blue, Yellow, Red etc. | ||
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. | ||
This PCB possess a 2-layer rigid structure, featuring a 0.5 mm TP300 core with 35 μm copper layers on either side. Its dimensions measure 53.2 mm x 66.56 mm (± 0.15 mm), with a finished thickness of 0.6 mm. It supports minimum trace and space specifications of 4/7 mils and accommodates a minimum hole size of 0.25 mm. The surface finish is immersion silver, enhancing solderability and overall performance.
Artwork is provided in Gerber RS-274-X format, and the PCB adheres to IPC-Class-2 quality standards. It is available for worldwide, ensuring accessibility for engineers.
Typical Applications
Ideal applications for the TP300 PCB include:
- GPS antennas
- Missile-borne systems
- Fuzes
- Miniaturized antennas
With its advanced features and high reliability, the TP300 PCB is an exceptional choice for modern high-frequency electronic designs.
