Bicheng Electronics Technology Co., Ltd
We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified
Add to Cart
The Rogers RO3010 PCB is a state-of-the-art printed circuit board made from advanced ceramic-filled PTFE composites. Engineered for high-performance applications, it offers a high dielectric constant and exceptional stability, making it suitable for a diverse range of electronic designs. The RO3010 simplifies the creation of broadband components and supports circuit miniaturization, making it an ideal choice for engineers focused on precision and reliability.
Key Features
High Dielectric Constant: 10.2 ± 0.30 at 10 GHz/23°C, ensuring superior signal integrity.
Low Dissipation Factor: 0.0022 at 10 GHz/23°C, minimizing energy loss and enhancing system efficiency.
Thermal Stability:
Coefficient of Thermal Expansion (CTE):
X: 13 ppm/°C
Y: 11 ppm/°C
Z: 16 ppm/°C
Operating temperature range: -40°C to +85°C.
Thermal Decomposition Temperature (Td): Greater than 500°C, providing durability under extreme conditions.
Thermal Conductivity: 0.95 W/mK, facilitating effective heat management.
Moisture Absorption: Only 0.05%, ensuring reliability in diverse environments.
| Property | RO3010 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 10.2±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 11.2 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0022 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -395 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.35 0.31 | X Y | mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 105 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 105 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 1902 1934 | X Y | MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.05 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
| Specific Heat | 0.8 | j/g/k | Calculated | ||
| Thermal Conductivity | 0.95 | W/M/K | 50℃ | ASTM D 5470 | |
| Coefficient of Thermal Expansion (-55 to 288℃) | 13 11 16 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ℃ TGA | ASTM D 3850 | ||
| Density | 2.8 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 9.4 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes |
Benefits
Dimensional Stability: With an expansion coefficient closely matched to copper, the RO3010 ensures reliability during thermal cycling.
Cost-Effective Manufacturing: Economical laminate pricing makes it suitable for high-volume production without compromising quality.
Versatile Design Options: Ideal for multi-layer board designs, accommodating complex circuit layouts.
Technical Specifications
PCB Stackup: 3-layer rigid PCB
Copper Layer 1: 35 μm
RO3010 Core: 50 mil (1.27 mm)
Copper Layer 2: 35 μm
Prepreg: 0.1 mm
RO3010 Core: 50 mil (1.27 mm)
Copper Layer 3: 35 μm
The finished board dimensions are 30 mm x 25 mm, with a total thickness of 2.7 mm. It supports minimum trace and space of 5/5 mils and has a minimum hole size of 0.5 mm. The finished copper weight on the outer layers is 1 oz (1.4 mils), and the surface finish is immersion tin. Each PCB undergoes 100% electrical testing prior to shipment, ensuring quality and reliability.
The Rogers RO3010 PCB is ideal for a variety of applications, including automotive radar, GPS antennas, cellular telecommunications systems, patch antennas for wireless communications, direct broadcast satellites, data links in cable systems, remote meter readers, and power backplanes. Its versatility and performance make it a valuable asset in many high-demand environments.
