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Introducing the TSM-DS3 PCB, a cutting-edge printed circuit board engineered from a ceramic-filled reinforced material that sets a new standard in the industry. With very low fiberglass content (approximately 5%), TSM-DS3 rivals traditional epoxies in fabricating large-format complex multilayer designs. This innovative PCB is specifically developed for high-power applications, ensuring thermal stability and low loss for optimal performance in demanding environments.
Key Features
The TSM-DS3 PCB boasts a dielectric constant of 3.0 with a tight tolerance of ± 0.05 at 10 GHz/23°C, making it ideal for high-frequency applications. The dissipation factor is impressively low at 0.0014 at 10 GHz, contributing to minimal signal loss and enhanced reliability. With a high thermal conductivity of 0.65 W/m*K (unclad), this material efficiently dissipates heat away from critical components, ensuring that your designs remain stable even under high power conditions.
This PCB features low moisture absorption at just 0.07%, along with a coefficient of thermal expansion (CTE) that is matched to copper: 10 ppm/°C in the X-axis, 16 ppm/°C in the Y-axis, and 23 ppm/°C in the Z-axis. This ensures dimensional stability and reliability in thermal cycling environments.
| Property | Test Method | Unit | TSM-DS3 | Unit | TSM-DS3 |
| Dk | IPC-650 2.5.5.3 | 3.00 | 3.00 | ||
| TcK (-30 to 120 °C) | IPC-650 2.5.5.5.1 (Modified) | ppm | 5.4 | ppm | 5.4 |
| Df | IPC-650 2.5.5.5.1 (Modified) | 0.0011 | 0.0011 | ||
| Dielectric Breakdown | IPC-650 2.5.6 (ASTM D 149) | kV | 47.5 | kV | 47.5 |
| Dielectric Strength | ASTM D 149 (Through Plane) | V/mil | 548 | V/mm | 21,575 |
| Arc Resistance | IPC-650 2.5.1 | Seconds | 226 | Seconds | 226 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.07 | % | 0.07 |
| Flexural Strength (MD) | ASTM D 790/ IPC-650 2.4.4 | psi | 11,811 | N/mm2 | 81 |
| Flexural Strength (CD) | ASTM D 790/ IPC-650 2.4.4 | psi | 7,512 | N/mm2 | 51 |
| Tensile Strength (MD) | ASTM D 3039/IPC-650 2.4.19 | psi | 7,030 | N/mm2 | 48 |
| Tensile Strength (CD) | ASTM D 3039/IPC-650 2.4.19 | psi | 3,830 | N/mm2 | 26 |
| Elongation at Break (MD) | ASTM D 3039/IPC-650 2.4.19 | % | 1.6 | % | 1.6 |
| Elongation at Break (CD) | ASTM D 3039/IPC-650 2.4.19 | % | 1.5 | % | 1.5 |
| Young’s Modulus (MD) | ASTM D 3039/IPC-650 2.4.19 | psi | 973,000 | N/mm2 | 6,708 |
| Young’s Modulus (CD) | ASTM D 3039/IPC-650 2.4.19 | psi | 984,000 | N/mm2 | 6,784 |
| Poisson’s Ratio (MD) | ASTM D 3039/IPC-650 2.4.19 | 0.24 | 0.24 | ||
| Poisson’s Ratio (CD) | ASTM D 3039/IPC-650 2.4.19 | 0.20 | 0.20 | ||
| Compressive Modulus | ASTM D 695 (23.C) | psi | 310,000 | N/mm2 | 2,137 |
| Flexural Modulus (MD) | ASTM D 790/IPC-650 2.4.4 | kpsi | 1,860 | N/mm2 | 12,824 |
| Flexural Modulus (CD) | ASTM D 790/IPC-650 2.4.4 | kpsi | 1,740 | N/mm2 | 11,996 |
| Peel Strength (CV1) | IPC-650 2.4.8 Sec 5.2.2 (TS) | lbs/in | 8 | N/mm | 1.46 |
| Thermal Conductivity (unclad) | ASTM F 433/ASTM 1530-06 | W/M*K | 0.65 | W/M*K | 0.65 |
| Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in. | 0.21 | mm/M | 0.21 |
| Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in. | 0.20 | mm/M | 0.20 |
| Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.5 (TS) | mils/in. | 0.15 | mm/M | 0.15 |
| Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.5 (TS) | mils/in. | 0.10 | mm/M | 0.10 |
| Surface Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (ET) | Mohms | 2.3 x 10^6 | Mohms | 2.3 x 10^6 |
| Surface Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (HC) | Mohms | 2.1 x 10^7 | Mohms | 2.1 x 10^7 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (ET) | Mohms/cm | 1.1 x 10^7 | Mohms/cm | 1.1 x 10^7 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (HC) | Mohms/cm | 1.8 x 10^8 | Mohms/cm | 1.8 x 10^8 |
| CTE (x axis) (RT to 125ºC) | IPC-650 2.4.41/TMA | ppm/ºC | 10 | ppm/ºC | 10 |
| CTE (y axis) (RT to 125ºC) | IPC-650 2.4.41/TMA | ppm/ºC | 16 | ppm/ºC | 16 |
| CTE (z axis) (RT to 125ºC) | IPC-650 2.4.41/TMA | ppm/ºC | 23 | ppm/ºC | 23 |
| Density (Specific Gravity) | ASTM D 792 | g/cm3 | 2.11 | g/cm3 | 2.11 |
| Hardness | ASTM D 2240 (Shore D) | 79 | 79 | ||
| Td (2% Weight Loss) | IPC-650 2.4.24.6 (TGA) | ºC | 526 | ºC | 526 |
| Td (5% Weight Loss) | IPC-650 2.4.24.6 (TGA) | ºC | 551 | ºC | 551 |
Benefits
The TSM-DS3 PCB offers numerous advantages for engineers and designers:
- Low Fiberglass Content: With only ~5% fiberglass, the PCB maintains high performance while minimizing potential weaknesses associated with traditional materials.
- Dimensional Stability: The material's stability rivals that of conventional epoxy, enabling the fabrication of large-format, high-layer count PCBs.
- Consistency and Predictability: TSM-DS3 allows for complex PCBs to be built with high yield, ensuring reliability in production.
- Temperature Stability: The dielectric constant remains stable (± 0.25%) across a wide temperature range of -30°C to 120°C, making it suitable for various applications.
- Compatibility: The material is compatible with resistive foils, enhancing its versatility in design.
| PCB Material: | Ceramic-filled Woven Fiberglass PTFE Laminates |
| Designation: | TSM-DS3 |
| Dielectric constant: | 3 +/-0.05 |
| Dissipation factor | 0.0011 |
| Layer count: | Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm), 90mil (2.286mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc.. |
PCB Specifications
The stackup for this rigid PCB consists of:
- Copper Layer 1: 35 μm
- TSM-DS3 Core: 0.508 mm (20 mil)
- Copper Layer 2: 35 μm
This PCB features dimensions of 92.3 mm x 41.52 mm (± 0.15 mm), providing ample space for complex circuitry. It supports a minimum trace/space of 5/9 mils and a minimum hole size of 0.5 mm, allowing for intricate designs. The finished board thickness is 0.5 mm, with a finished copper weight of 1 oz (1.4 mils) on the outer layers.
Quality Assurance
Prior to shipment, each PCB undergoes a 100% electrical test, ensuring that every unit meets the highest standards of quality. The surface finish is immersion silver, providing excellent solderability, while the top silkscreen is printed in white. The top solder mask is green, further enhancing the board's design.
Applications
The TSM-DS3 PCB is ideal for a variety of high-performance applications, including:
- Couplers: Essential for RF signal management.
- Phased Array Antennas: Perfect for advanced communication systems.
- Radar Manifolds: Designed for precision in radar applications.
- mmWave Antennas: Suitable for automotive and high-frequency communication.
- Oil Drilling Equipment: Engineered for reliability in harsh environments.
- Semiconductor/ATE Testing: Ideal for testing and measurement applications.
Conclusion
The TSM-DS3 PCB represents a significant advancement in printed circuit board technology, combining low loss, thermal stability, and excellent dimensional characteristics in a single solution. Whether you are designing high-power applications or complex multilayers, this PCB delivers the performance and reliability required to succeed in today’s competitive landscape. Choose the TSM-DS3 PCB for your next project and experience the difference in quality and performance.