Bicheng Electronics Technology Co., Ltd
We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified
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We proudly present our advanced 4-layer rigid PCB, constructed with FR408HR material, specifically designed to meet the rigorous demands of high reliability and exceptional performance across various electronic applications. Whether utilized in high-speed digital devices, networking communications, or medical and industrial equipment, this PCB is engineered to deliver outstanding results, ensuring longevity and efficiency in your electronic projects.
Key Specifications: Robust Features for Optimal Performance
This PCB boasts a variety of key specifications that make it suitable for challenging environments:
- Layers: 4 Layers
- Material: FR408HR
- Solder Mask: Blue on both sides
- Silkscreen Print: White on both sides
- Surface Finish: ENIG (Electroless Nickel Immersion Gold)
- Total Thickness: 1.6mm ± 10%
- Size:** 140mm x 160mm
- Minimum Hole Size: 0.3mm
- Solder Mask Thickness: 10µm
- Minimum Dielectric Thickness: 100µm
- Minimum Trace Width: 102µm
- Minimum Spacing: 102µm
- Via Features: Via filled and capped (No blind or buried vias)
These specifications are meticulously designed to ensure high performance and reliability in a variety of applications.
PCB Stack-Up: Strategic Layer Arrangement
The stack-up of this PCB is carefully designed to optimize its functionality and durability:
- Layer 1: 45µm Copper, providing a solid foundation for electrical connectivity.
- Layer 2: 35µm Copper on FR408HR (100µm Prepreg), ensuring minimal signal loss.
- Layer 3: 35µm Copper on FR408HR (1230µm Core), enhancing thermal management.
- Layer 4: 45µm Copper, completing the robust multi-layer structure.
This strategic arrangement allows for excellent electrical performance and heat dissipation, making it ideal for high-density applications.
Quality and Compliance: Adherence to Industry Standards
This PCB adheres to IPC-Class-3 quality standards, ensuring reliability and performance excellence. It is available worldwide, making it accessible for various projects. The provided artwork follows the Gerber RS-274-X format, guaranteeing compatibility with industry standards and facilitating a smooth production process.
Advantages of FR408HR Material: Superior Performance Characteristics
The FR408HR laminate and prepreg are engineered with Isola’s patented resin system, which offers several advantages:
- Improved Z-Axis Expansion: 30% better than competing products, ensuring stability under thermal stress.
- Higher Electrical Bandwidth: 25% lower loss improves signal integrity, essential for high-speed applications.
- Superior Moisture Resistance: Outstanding performance during reflow processes, reducing the risk of defects.
- Compatibility: Laser fluorescing and UV blocking enhance inspection accuracy and production efficiency.
These features make FR408HR an excellent choice for demanding environments.
Key Features: Technical Specifications
- Glass Transition Temperature (Tg): 190°C, ensuring thermal stability.
- Dielectric Constant: 3.65 @ 10GHz, providing reliable signal transmission.
- Dissipation Factor: 0.0095 @ 10GHz, minimizing energy loss.
- RoHS Compliant: Environmentally friendly, meeting regulatory standards.
- CAF Resistant: Suitable for lead-free assembly processes.
- Reflow Capable: Up to 6 times at 260°C, accommodating various soldering techniques.
Typical Applications: Versatile Use Cases
This PCB is perfectly suited for a wide range of applications, including:
- High-Density Interconnect (HDI) Applications: Ideal for compact designs requiring efficient space utilization.
- High-Speed Digital Devices: Supports fast data transfer rates and reliable performance.
- Networking and Communication Equipment: Ensures stable connections and minimal signal degradation.
- Medical and Industrial Instrumentation: Provides reliability and precision in critical environments.
In summary, our high-performance 4-layer rigid PCB is a versatile solution tailored to meet the needs of modern electronics, combining robust specifications with advanced material technology.