Bicheng Electronics Technology Co., Ltd
We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified
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1. Brief Introduction
This ceramic PCB is made from high-quality AL2O3 (96%) ceramic material, offering excellent thermal conductivity, insulation, and mechanical strength. It features a 2-layer design with 1mm dielectric thickness. The 1oz copper on both sides ensure superior conductivity and signal transmission quality. No solder mask or silkscreen characters are applied. Its surface is plated with immersion gold with a 2 micro-inch thickness, endowing it with excellent solderability, oxidation resistance and corrosion resistance. It is suitable for electronic devices requiring high power, high frequency, and high reliability.
2. Basic Specifications
Board dimensions: 98mm x 98mm=1PCS, +/- 0.15mm
Minimum Trace/Space: 6/6 mils
Minimum Hole Size: 0.3mm
No Blind vias.
Finished board thickness: 1.1mm
Finished Cu weight: 1oz (1.4 mils) outer layers
Via plating thickness: 20 μm
Surface finish: Immersion Gold
Top Silkscreen: No
Bottom Silkscreen: No
Top Solder Mask: No
Bottom Solder Mask: No
100% Electrical test used prior to shipment
| PCB SIZE | 98 x 98mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Double sided Ceramic PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 35um(1oz) |
| 96% AL2O3 1.0mm | |
| copper ------- 35um(1oz) | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 6mil/6mil |
| Minimum / Maximum Holes: | 0.3mm / 0.8mm |
| Number of Different Holes: | 7 |
| Number of Drill Holes: | 27 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 1 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | 96% AL2O3 1.0mm |
| Final foil external: | 1.0 oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 1.1 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold |
| Solder Mask Apply To: | NO |
| Solder Mask Color: | NO |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | NO |
| Colour of Component Legend | NO |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated Through Hole(PTH) |
| FLAMIBILITY RATING | 94 V-0 |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
3. Introduction of Al₂O₃ 96% Ceramic Material
The 96% purity alumina ceramic copper-clad laminate is a high-performance electronic substrate material, composed of a 96% alumina (Al₂O₃) ceramic substrate and a high-purity copper layer laminated on the surface. The ceramic substrate is made through a precision sintering process, and the copper layer is strongly bonded to the ceramic by Direct Bonded Copper (DBC) or Active Metal Brazing (AMB) technology, combining structural stability and functional characteristics.
Characteristics
High Thermal Conductivity: The thermal conductivity of 96% alumina is approximately 24 - 28 W/(m·K), which can effectively conduct the heat generated by high-power devices, outperforming ordinary PCB base materials.
Excellent Insulation: The ceramic substrate has a high resistivity (＞10¹⁴ Ω·cm) and a breakdown voltage of 15 - 20 kV/mm, ensuring circuit safety.
Thermal Expansion Matching: The coefficient of thermal expansion of alumina is close to that of silicon chips (~7.1×10⁻⁶/℃), reducing the risk of failure caused by thermal stress.
High Mechanical Strength: The flexural strength is ≥300 MPa, and it can withstand high temperatures (long - term operating temperature ＞800℃), adapting to harsh working environments.
Cost-effectiveness: Compared with 99% high-purity alumina, 96% purity reduces raw material costs while maintaining performance, making it suitable for large-scale applications.
Core Processes
Surface Metallization: Through the DBC process, an eutectic layer is formed on the surface of alumina by oxidation, and then bonded to the copper foil at high temperatures (above 1065℃); or the AMB process is used to achieve low-temperature brazing through active solder.
Precision Pattern Formation: Lithography and etching techniques are used to process micro-circuits on the copper layer to meet the requirements of high-density packaging.
Application Fields
Power Electronics: IGBT modules, new energy vehicle motor controllers, photovoltaic inverters, etc., to carry high currents and dissipate heat quickly.
LED Lighting: As a COB (Chip - on - Board) substrate, it improves the heat dissipation efficiency and lifespan of high - power LEDs.
RF/Microwave Devices: Used in high-frequency circuits of 5G communication base stations and radar systems. The low dielectric loss (tanδ＜0.001) ensures signal integrity.
Aerospace: Its high - temperature resistance and radiation - resistance characteristics are suitable for satellite power systems and avionics equipment.
Comparison and Advantages
Compared with aluminum nitride (AlN) or silicon nitride (Si₃N₄) substrates, the 96% alumina copper-clad laminate has more advantages in terms of cost and process maturity; compared with epoxy - resin - based PCBs, its heat - resistance and thermal conductivity are significantly improved, making it suitable for scenarios with a power density ＞100 W/cm².
Development Trends
With the miniaturization and high-powerization of electronic devices, this material is developing towards ultra - thin types (substrate thickness ＜0.2 mm), multi - layer structures and 3D integration. At the same time, its thermo-mechanical properties are optimized through doping modification, expanding to emerging fields such as new energy and smart grids.
Ceramic Parameters
| Items | Unit | Al2O3 | ZTA |
| Density | g/cm3 | ≥3.75 | ≥3.95 |
| Roughness (Ra) | μm | ≤0.6 | Ra≤0.6 |
| Bending strength | Mpa | ≥400 | ≥600 |
| Coefficient of thermal expansion | 10^-6/K | ≤6.9 (40-400℃) | 7.5 (40-400℃) |
| Thermal conductivity | W/(m*K) | ≥24 (25℃) | 26 (25℃) |
| Dielectric constant | 1MHz | 9.8 | 10.2 |
| Dielectric loss | 1MHz | 2*10^-4 | 2*10^-4 |
| Volume resistivity | Ω*cm | >10^14 (25℃) | >10^14 (25℃) |
| Dielectric strength | kV/mm | >15 | >15 |
Material Thickness
| Ceramic Thickness | |||||||
| 0.25mm | 0.32mm | 0.38mm | 0.50mm | 0.63mm | 1.0mm | ||
| Copper Thickness | 0.15mm | ZTA | ZTA | Al2O3 | Al2O3 | Al2O3 | Al2O3 |
| 0.20mm | ZTA | ZTA | Al2O3 | Al2O3 | Al2O3 | Al2O3 | |
| 0.25mm | ZTA | ZTA | Al2O3 | Al2O3 | Al2O3 | Al2O3 | |
| 0.30mm | ZTA | ZTA | Al2O3 | Al2O3 | Al2O3 | Al2O3 | |
| 0.40mm | ZTA | ZTA | - | - | - | - | |
4. Our PCB processing Capability
We can process precision circuits with a line width/space of 3mil/3mil and a conductor thickness of 0.5oz-14oz. We also has processing capabilities such as micro-via filling, the inorganic dam process, and 3D circuit fabrication.
We can handle different processing thicknesses, such as 0.25mm, 0.38mm, 0.5mm, 0.635mm, 1.0mm, 1.5mm, 2.0mm, 2.5mm, 3.0mm, etc.
We offer diversified surface treatments, including Electroplated gold process (1-30u"), Electroless Nickle Palladium Immersion gold process (1 - 5u"), Electroplate silver process (3 - 30um), Electroplated nickel process (3 - 10um), Immersion tin process (1 - 3um), etc
