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Brief Introduction
This type of ceramic circuit board adopts an complicated 6-layer board design and selects aluminum nitride (AlN) as the substrate. Aluminum nitride features excellent thermal conductivity and electrical insulation properties, enabling efficient heat dissipation. The finished board thickness is 1.5mm, and both the inner and outer layers are 1oz finished copper. This PCB is free of solder mask and silkscreen characters, and the surface finish adopts a 2 micro-inch (2u") immersion gold. They are manufactured per IPC-Class-2 standard.
Basic Specifications
Board dimensions: 51 mm x 52 mm=1PCS, +/- 0.15mm
Minimum Trace/Space: 5/5 mils
Minimum Hole Size: 0.4mm
No Blind vias.
Finished board thickness: 1.5mm +/-10%
Finished Cu weight: 1oz (1.4 mils) outer layers
Via plating thickness: 20 μm
Surface finish: Electroless Nickel Immersion Gold (ENIG)
Top Silkscreen: No
Bottom Silkscreen: No
Top Solder Mask: No
Bottom Solder Mask: No
100% Electrical test used prior to shipment
| PCB SIZE | 51 x 52mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Double sided Ceramic PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 35um(1oz) |
| AlN Ceramic -0.39mm | |
| copper ------- 35um(1oz) | |
| ----Prepreg---- | |
| copper ------- 35um(1oz) | |
| AlN Ceramic -0.39mm | |
| copper ------- 35um(1oz) | |
| ----Prepreg---- | |
| copper ------- 35um(1oz) | |
| AlN Ceramic -0.39mm | |
| copper ------- 35um(1oz) | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5mil / 5mil |
| Minimum / Maximum Holes: | 0.4mm / 1.0mm |
| Number of Different Holes: | 8 |
| Number of Drill Holes: | 31 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 1 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | AIN Ceramic |
| Final foil external: | 1.0 oz |
| Final foil internal: | 1.0 oz |
| Final height of PCB: | 1.5 mm ±0.15mm |
| PLATING AND COATING | |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Solder Mask Apply To: | NO |
| Solder Mask Color: | NO |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | NO |
| Colour of Component Legend | NO |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated Through Hole(PTH) |
| FLAMIBILITY RATING | 94 V-0 |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Introduction of AlN Ceramic Substrates
Aluminum Nitride Ceramic Copper Clad Laminate (AlN copper clad laminate for short) is a special electronic material with aluminum nitride (AlN) ceramic as the substrate and a high-purity copper layer on the surface. It combines the ultra-high thermal conductivity of aluminum nitride ceramic, excellent electrical insulation, and the superior electrical conductivity of metallic copper, becoming one of the core materials in the fields of high-power electronic devices, high-frequency communication, new energy vehicles, etc., and is known as the "ultimate solution to the heat dissipation problem in the electronics industry".
Features & Benefits
1. Ultra-high Thermal Conductivity Performance
The thermal conductivity of aluminum nitride is as high as 170-200 W/(m·K), which is 8-10 times that of traditional aluminum oxide ceramic (Al₂O₃). It can quickly conduct the heat generated by electronic components to the heat dissipation system, significantly reducing the chip junction temperature and improving the reliability and lifespan of the equipment.
2. Low Coefficient of Thermal Expansion, Matching Semiconductor Materials
The coefficient of thermal expansion of aluminum nitride (4.5×10⁻⁶/℃) is close to that of semiconductor materials such as silicon (Si) and silicon carbide (SiC), which can greatly reduce the risk of stress cracking during thermal cycling and is suitable for high-temperature and high-power scenarios.
3. Excellent Electrical Insulation and High-frequency Performance
Aluminum nitride has a low dielectric constant (8.8-9.5) and low dielectric loss (<0.001), which can effectively reduce signal delay and energy loss during high-frequency signal transmission, making it an ideal choice for high-frequency devices such as 5G base stations and millimeter-wave radars.
4. High Mechanical Strength and Corrosion Resistance
Aluminum nitride ceramic has high hardness and strong chemical stability. The copper cladding processes (such as Direct Bonding of Copper, DBC or Active Metal Brazing, AMB) ensure a tight bond between the copper layer and the substrate. It is resistant to high temperature and corrosion and can be used for a long time in harsh environments.
Data Sheets
| Items | Unit | Al2O3 | Si3N4 |
| Density | g/cm3 | ≥3.3 | ≥3.22 |
| Roughness (Ra) | μm | ≤0.6 | ≤0.7 |
| Bending strength | Mpa | ≥450 | ≥700 |
| Coefficient of thermal expansion | 10^-6/K | 4.6~5.2 (40-400℃) | 2.5~3.1 (40-400℃) |
| Thermal conductivity | W/(m*K) | ≥170 (25℃) | 80 (25℃) |
| Dielectric constant | 1MHz | 9 | 9 |
| Dielectric loss | 1MHz | 2*10^-4 | 2*10^-4 |
| Volume resistivity | Ω*cm | >10^14 (25℃) | >10^14 (25℃) |
| Dielectric strength | kV/mm | >20 | >15 |
Material Thickness
| Copper Thickness | ||||||
| 0.15mm | 0.25mm | 0.30mm | 0.50mm | 0.8mm | ||
| Ceramic Thickness | 0.25mm | Si3N4 | Si3N4 | Si3N4 | Si3N4 | - |
| 0.32mm | Si3N4 | Si3N4 | Si3N4 | Si3N4 | Si3N4 | |
| 0.38mm | AlN | AlN | AlN | - | - | |
| 0.50mm | AlN | AlN | AlN | - | - | |
| 0.63mm | AlN | AlN | AlN | - | - | |
| 1.00mm | AlN | AlN | AlN | - | - | |
Typical Applications
Electric Vehicle Inverters:
Using a 1mm aluminum nitride substrate as the heat dissipation carrier for the IGBT reduces the operating temperature of the module by 20-30℃, improving energy efficiency and lifespan.
GaN Power Amplifier Modules in 5G Base Stations:
The aluminum nitride substrate solves the problem of high-frequency heat generation and ensures signal stability.
Industrial Laser Cutting Machines:
It is used for heat dissipation of the CO₂ laser circuit, avoiding the beam drift caused by high temperatures.
Future Trends
With the popularization of third-generation semiconductors (SiC, GaN), the demand for heat dissipation in high-power density devices has surged. Aluminum nitride ceramic circuit boards will continue to expand in the following fields:
• New Energy: Photovoltaic inverters, energy storage systems.
• Artificial Intelligence: Heat dissipation carrier boards for AI chips.
• 6G Communication: Substrate materials for terahertz frequency band circuits.
