Bicheng Electronics Technology Co., Ltd
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Introducing our high-performance 2-layer PCB, meticulously engineered for advanced applications. This board is constructed from Rogers RT/duroid 6002, a ceramic-filled PTFE material renowned for its low dielectric constant and exceptional high-frequency performance.
PCB Construction: An Overview
Our 2-layer PCB is designed with precision, featuring:
- Base Material: Rogers RT/Duroid 6002, a ceramic-filled PTFE laminate known for its superior electrical and mechanical properties.
- Layer Count: 2 layers, ensuring a compact design while maintaining performance.
- Board Dimensions: 390mm x 310.9mm, providing ample space for complex circuitry.
- Minimum Trace/Space: 4/5 mils, allowing for dense layouts that are critical in modern electronics.
- Minimum Hole Size: 0.2mm, facilitating the integration of finer components.
- Finished Board Thickness: 0.2mm, which is ideal for applications requiring minimal weight and thickness.
- Surface Finish: Immersion Tin, providing excellent solderability and protection against oxidation.
Electrical Integrity and Testing
Prior to shipment, each board undergoes 100% electrical testing, ensuring reliability and performance. This rigorous quality control process guarantees that our customers receive only the highest quality PCBs, ready for deployment in mission-critical applications.
| Property | RT/duroid 6002 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 2.94±0.04 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Dielectric Constant,εDesign | 2.94 | 8GHz to 40 GHz | Differential Phase Length Method | ||
| Dissipation Factor,tanδ | 0.0012 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +12 | Z | ppm/℃ | 10 GHz 0℃-100℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 106 | Z | Mohm.cm | A | ASTM D 257 |
| Surface Resistivity | 107 | Z | Mohm | A | ASTM D 257 |
| Tensile Modulus | 828(120) | X,Y | MPa(kpsi) | 23℃ | ASTM D 638 |
| Ultimate Stress | 6.9(1.0) | X,Y | MPa(kpsi) | ||
| Ultimate Strain | 7.3 | X,Y | % | ||
| Compressive Modulus | 2482(360) | Z | MPa(kpsi) | ASTM D 638 | |
| Moisture Absorption | 0.02 | % | D48/50 | IPC-TM-650 2.6.2.1 ASTM D 570 | |
| Thermal Conductivity | 0.6 | W/m/k | 80℃ | ASTM C518 | |
| Coefficient of Thermal Expansion (-55 to 288℃) | 16 16 24 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | ℃ TGA | ASTM D 3850 | ||
| Density | 2.1 | gm/cm3 | ASTM D 792 | ||
| Specific Heat | 0.93(0.22) | j/g/k (BTU/ib/OF) | Calculated | ||
| Copper Peel | 8.9(1.6) | Ibs/in.(N/mm) | IPC-TM-650 2.4.8 | ||
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes |
Material Insights: Rogers RT/Duroid 6002
What Makes RT/Duroid 6002 Special?
Rogers RT/Duroid 6002 is a unique material characterized by:
- Low Dielectric Constant (Dk): 2.94 +/- 0.04, which minimizes signal loss at high frequencies.
- Low Thermal Coefficient of Dk: 12 ppm/°C, ensuring stability across temperature variations.
- Dissipation Factor: 0.0012 at 10GHz, ideal for microwave applications.
- Thermal Conductivity: 0.6 W/m/k, providing efficient heat dissipation.
- Moisture Absorption: 0.02%, which is critical for maintaining performance in humid environments.
Benefits of Using RT/Duroid 6002
1. Low Loss Characteristics: The material allows for excellent high-frequency performance, making it suitable for RF and microwave applications.
2. Dimensional Stability: Its low coefficient of thermal expansion reduces the risk of warping or distortion, ensuring the integrity of the board over time.
3. Mechanical Reliability: RT/Duroid 6002 offers robust mechanical properties, making it ideal for applications where durability is essential.
PCB Stack-up
The stackup of our 2-layer PCB consists of:
- Copper Layer 1: 35 μm
- Rogers RT/Duroid 6002 Substrate: 5 mil (0.127mm)
- Copper Layer 2: 35 μm
This configuration optimizes the electrical performance while maintaining a lightweight profile, necessary for modern electronic devices.
Typical Applications
Our 2-layer PCB is particularly well-suited for:
- Phased Array Antennas: Essential in advanced communication systems.
- Radar Systems: Both ground-based and airborne, where precision is critical.
- GPS Antennas: Supporting navigation technologies globally.
- Power Backplanes: Facilitating efficient power distribution in high-performance systems.
- Commercial Airline Collision Avoidance Systems: Enhancing safety in aviation.
- Beam Forming Networks: Key in signal processing and transmission.
Conclusion
In conclusion, our newly shipped 2-layer PCB made from Rogers RT/Duroid 6002 and featuring an immersion tin surface finish represents a significant advancement in PCB technology. With its exceptional electrical performance, robust construction, and suitability for various demanding applications, this PCB is poised to meet the needs of industries ranging from telecommunications to aerospace.
By choosing our PCB, you are opting for reliability, performance, and innovation. We are committed to providing our customers with the highest quality products that enhance their designs and drive their success in the competitive electronics market.
For inquiries or to place an order, please contact our sales team today!