Bicheng Electronics Technology Co., Ltd
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We are pleased to present the TFA300 double-sided PCB, a state-of-the-art solution designed for high-frequency and high-reliability applications. This PCB has been specifically engineered to meet the rigorous demands of industries such as aerospace, telecommunications, and advanced electronics, where performance and stability are paramount.
PCB Construction and Specifications
Material Composition
The TFA300 PCB is constructed using a unique composite material that combines PTFE resin with specially formulated ceramics. This innovative approach eliminates traditional glass fiber, resulting in several key advantages:
- Exceptional Electrical Properties: The absence of fiberglass minimizes dielectric loss, allowing for superior signal integrity.
- Enhanced Thermal Management: The high thermal conductivity of 0.6 W/mk ensures effective heat dissipation, maintaining optimal performance even in demanding conditions.
Physical Characteristics
- Layer Count: This PCB features a 2-layer construction, optimizing space while providing robust electrical performance.
- Dimensions: Measuring 65mm x 51mm with a precision tolerance of ±0.15mm, this PCB is compact and versatile.
- Finished Board Thickness: At 0.3mm, the PCB maintains structural integrity while remaining lightweight.
- Copper Weight: The outer layers have a finished copper weight of 1oz (1.4 mils), ensuring excellent conductivity.
Electrical Specifications
- Minimum Trace/Space: The design accommodates a minimum trace and space of 5/7 mils, allowing for the integration of densely packed components.
- Minimum Hole Size: Vias can be as small as 0.3mm, supporting advanced circuit designs.
- Via Plating Thickness: A plating thickness of 20 μm is utilized to ensure reliable connections between layers.
Quality Assurance
Manufactured to IPC-Class-2 standards, each PCB undergoes rigorous testing to ensure functionality and reliability before shipment. This commitment to quality is crucial for applications in critical environments.
Advanced Features
Dielectric Properties
The TFA300 material exhibits a dielectric constant (Dk) of 3.0±0.04 at 10GHz, making it ideal for high-frequency applications. The low dissipation factor of 0.001 at 10GHz and 0.0012 at 40GHz ensures that signal integrity is preserved, reducing losses during transmission.
Thermal Characteristics
The thermal coefficient of dielectric constant (TCDK) is measured at -8 ppm/°C, providing excellent stability across a wide temperature range of -55°C to 150°C. This stability is essential for applications that experience varying thermal conditions.
Moisture Absorption
With a moisture absorption rate of just 0.04%, the TFA300 PCB is designed to perform reliably in diverse environmental settings, minimizing the risk of degradation.
Typical Applications
TFA300 PCB is well-suited for a variety of applications, including:
- Aerospace Equipment: Ideal for in-cabin systems and crucial aerospace applications that demand high reliability.
- Microwaves and Antennas: Supports phase-sensitive antennas and other microwave applications requiring precise signal handling.
- Radar Systems: Effective for early warning and airborne radar systems, benefiting from the material’s low loss characteristics.
- Phased Array Antennas: Facilitates advanced beamforming networks and satellite communications, ensuring efficient signal processing.
- Power Amplifiers: Optimizes performance in high-power applications, enhancing overall system efficiency.
Conclusion
TFA300 PCB represents a significant advancement in PCB technology, offering exceptional performance and reliability for high-frequency applications. Its unique material properties, rigorous quality assurance, and versatility make it an ideal choice for engineers and designers facing the challenges of modern electronics.
With worldwide availability, the TFA300 PCB is ready to support your most demanding projects. For further inquiries or to place an order, please contact our sales team. We look forward to assisting you in achieving your project goals with this cutting-edge product.