Bicheng Electronics Technology Co., Ltd
We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified
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This advanced 6-layer rigid PCB is designed for high-frequency and high-reliability applications, combining Rogers RO4003C and Tg170 FR-4 materials for optimal electrical and mechanical performance. The board features a hybrid stack-up to balance cost, manufacturability, and signal integrity, making it ideal for RF and microwave applications.
| Specification Category | Details |
| Base Materials | Rogers RO4003C (high-frequency laminate) + Tg170 FR-4 (standard laminate) |
| Board Dimensions | 495mm × 345mm, with a tolerance of ±0.15mm |
| Layer Count | 6 layers |
| Finished Thickness | 6.8mm |
| Copper Weight | 1oz (35μm) on all layers |
| Minimum Trace/Space | 5 mils (trace) / 6 mils (space) |
| Minimum Hole Size | 0.8mm |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Gold (ENIG) |
| Blind/Buried Vias | None |
| Solder Mask & Silkscreen | None |
| Depth-Controlled Slots | Yes (present on top and bottom layers) |
| Electrical Testing | 100% tested before shipment |
PCB Stack-up Details
The stack-up is meticulously optimized to enhance signal integrity and thermal stability:
| Layer | Material | Thickness |
| Copper (L1) | 35μm (1oz) | - |
| Core | Tg170 FR-4 | 3.0mm |
| Copper (L2) | 35μm (1oz) | - |
| Bonding Ply | Prepreg (4mil) | 0.102mm |
| Copper (L3) | 35μm (1oz) | - |
| Core | Rogers RO4003C (12mil) | 0.305mm |
| Copper (L4) | 35μm (1oz) | - |
| Bonding Ply | Prepreg (4mil) | 0.102mm |
| Copper (L5) | 35μm (1oz) | - |
| Core | Tg170 FR-4 | 3.0mm |
| Copper (L6) | 35μm (1oz) | - |
Introduction to Rogers RO4003C Material
Rogers RO4003C is a high-frequency laminate that merges the electrical performance of PTFE/woven glass with the fabrication simplicity of epoxy/glass. It stands out in RF and microwave applications due to its tight dielectric constant control and low dissipation factor.
Key Features of Rogers RO4003C
1. Stable Dielectric Constant (Dk): Maintains a consistent 3.38 ±0.05 at 10GHz, ensuring reliable signal propagation in high-frequency designs.
2. Low Dissipation Factor (Df): Measures 0.0027 at 10GHz and 0.0021 at 2.5GHz, minimizing signal loss even in high-speed applications.
3. Effective Thermal Conductivity: 0.71 W/m/°K, facilitating efficient heat dissipation from active components.
4. Minimal Moisture Absorption: Only 0.06%, preserving electrical performance in humid environments.
Strong CTE Compatibility with Copper:
X-axis: 11 ppm/°C
Y-axis: 14 ppm/°C
Z-axis: 46 ppm/°C
This reduces stress between layers during thermal cycling, enhancing long-term reliability.
5. High Glass Transition Temperature (Tg >280°C): Ensures stability under extreme thermal stress, critical for rugged operating conditions.
Advantages of Using RO4003C
1. Ideal for Multi-Layer RF/Microwave PCBs: Balances high-frequency performance with the structural needs of complex layer stacks.
2. FR-4 Compatible Processing: Eliminates the need for specialized manufacturing techniques, lowering production costs and simplifying fabrication.
3. Enhanced Signal Integrity: Low Dk variation and minimal loss make it perfect for high-frequency signals (e.g., RF, microwave), reducing distortion and ensuring data accuracy.
4. Durable Plated Through-Holes (PTH): Maintains integrity even under thermal shock, a key requirement for reliable interconnects in demanding applications.
Typical Applications
This PCB is ideally suited for:
Cellular Base Station Antennas & Power Amplifiers
RF Identification (RFID) Tags
Automotive Radar & Sensors
Low-Noise Block (LNB) for Satellite Communications
High-Speed Digital & Mixed-Signal Designs
Conclusion
This 6-layer hybrid PCB harnesses the high-frequency capabilities of Rogers RO4003C and the structural robustness of Tg170 FR-4, resulting in a cost-effective yet high-performance solution for demanding RF and microwave applications.
Available worldwide, this PCB is an excellent option for engineers seeking a balance between performance, manufacturability, and cost.