Bicheng Electronics Technology Co., Ltd
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This high-performance printed circuit board (PCB) is meticulously engineered using Rogers' RO3206 high-frequency circuit material—a ceramic-filled laminate reinforced with woven fiberglass—to meet stringent electrical and mechanical standards, making it ideal for a wide range of high-frequency applications. Below is a comprehensive breakdown of its key specifications, construction details, and material attributes:
PCB Construction Details
| Parameter | Details |
| Base Material | Utilizes Rogers' RO3206, renowned for exceptional electrical performance and mechanical stability |
| Layer Count | 2-layer rigid PCB |
| Board Dimensions | 63mm x 45mm per piece, with a tight tolerance of +/- 0.15mm |
| Minimum Trace/Space | 4/4 mils, enabling the routing of fine signals critical for high-frequency operations. |
| Minimum Hole Size | 0.3mm |
| Finished Board Thickness | 0.75mm |
| Finished Copper Weight | 1oz (1.4 mils) on outer layers, ensuring low resistance and efficient current carrying. |
| Surface Finish | Immersion Gold |
| Silkscreen | White silkscreen on the top layer for clear component labeling |
| Solder Mask | Blue solder mask on the top layer for protection against solder bridging |
| Quality Assurance | Undergoes 100% electrical testing prior to shipment |
PCB Stack-up
The 2-layer rigid PCB features a precise stack-up designed for optimal signal integrity:
| Layer | Specification |
| Copper Layer 1 | 35 μm, providing a solid conductive path for signals. |
| RO3206 Substrate | 0.635mm(25mil) thickness |
| Copper Layer 2 | 35 μm, mirroring the top layer to maintain balanced electrical characteristics. |
Artwork and Standards
Artwork Supplied: Gerber RS-274-X, the industry-standard format for PCB manufacturing data, ensuring compatibility with production processes.
Accepted Standard: Manufactured to IPC-Class-2 specifications, ensuring high quality and reliability for general electronics applications.
RO3206 Material Overview
Rogers' RO3206 combines ceramic fillers with woven fiberglass reinforcement to deliver a balance of performance and affordability, making it a preferred choice for high-frequency designs. Its enhanced mechanical stability sets it apart within the RO3000 series.
Key Features of RO3206
Dielectric Constant: 6.15 with a tight tolerance of ±0.15 at 10 GHz/23°C, ensuring consistent signal propagation.
Dissipation Factor: 0.0027 at 10 GHz, minimizing signal loss at high frequencies.
Thermal Conductivity: 0.67 W/MK, efficient heat dissipation to prevent overheating.
Moisture Absorption: Less than 0.1%, maintaining performance in humid environments.
CTE Matching: Coefficient of thermal expansion (CTE) matched to copper (X-axis: 13 ppm/°C, Y-axis: 13 ppm/°C, Z-axis: 34 ppm/°C), reducing thermal stress during temperature fluctuations.
Copper Peel Strength: 10.7 lbs/in, ensuring strong adhesion between copper layers and the substrate for long-term reliability.
Benefits of the PCB
Woven Glass Reinforcement: Enhances rigidity, making the board easier to handle during assembly and reducing the risk of damage.
Uniform Performance: Consistent electrical and mechanical properties across the board, ideal for complex high-frequency structures.
Low Dielectric Loss: Enables superior high-frequency performance, critical for applications like wireless communications.
Low In-Plane Expansion: CTE matched to copper supports compatibility with epoxy multilayer hybrid designs and ensures reliable surface-mounted assemblies.
Dimensional Stability: Excellent stability leads to high production yields, reducing manufacturing costs.
Cost-Effectiveness: Economically priced, suitable for volume manufacturing without compromising quality.
Surface Smoothness: Allows for finer line etching tolerances, supporting the precise routing of small traces.
Typical Applications
This PCB is well-suited for a diverse range of applications, including:
-Automotive collision avoidance systems and global positioning satellite antennas
-Wireless telecommunications systems and microstrip patch antennas
-Direct broadcast satellites and datalink on cable systems
-Remote meter readers and power backplanes
-LMDS (Local Multipoint Distribution Service) and wireless broadband infrastructure
-Base station equipment for telecommunications networks
Availability: This PCB is available for worldwide shipping, ensuring accessibility for global manufacturing and project needs.